EP2AGZ300HF40I4N

The EP2AGZ300HF40I4N is an Arria II GZ field programmable gate array (FPGA) supplied in a 1517‑FBGA surface-mount package. It provides a high-density programmable fabric with 298,000 logic elements and approximately 18.85 Mbits of embedded memory, making it suitable for complex digital designs that require substantial on-chip logic and memory resources.

Targeted at industrial-grade applications, this device offers a broad I/O complement (734 I/Os), a controlled core voltage supply range (870 mV to 930 mV), and an operating temperature range from –40 °C to 100 °C, enabling deployment in systems that demand robust thermal and environmental tolerance.

Key Features

• High-density logic: 298,000 logic elements for large-scale, programmable digital designs and complex state-machine or datapath implementations.
• Embedded memory: Approximately 18.85 Mbits of on-chip RAM to support buffering, caching, and local data storage within the FPGA fabric.
• Extensive I/O: 734 I/Os to interface with multiple peripherals, sensors, and high-pin-count board-level systems.
• Industrial temperature range: Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Power supply: Core voltage requirement specified at 870 mV to 930 mV for consistent core operation.
• Package and mounting: 1517‑FBGA (40 × 40) FCBGA package, surface-mount mounting type for compact board-level integration.
• Regulatory compliance: RoHS compliant.

Typical Applications

• Industrial control systems: Use the industrial temperature rating and extensive I/O to implement robust control, monitoring, and digital interfacing functions.
• High-density digital processing: Leverage 298,000 logic elements and ~18.85 Mbits of embedded RAM for complex signal processing, protocol handling, or custom datapath acceleration.
• Board-level integration: The 1517‑FBGA surface-mount package supports compact, high-pin-count assemblies for edge devices and embedded platforms.

Unique Advantages

• Substantial programmable capacity: Large logic element count enables consolidation of multiple functions into a single device, reducing BOM and board complexity.
• On-chip memory for performance: Approximately 18.85 Mbits of embedded RAM reduces external memory dependence and supports low-latency data paths.
• High I/O count: 734 I/Os facilitate interfacing to a wide range of peripherals and large connector arrays without external multiplexing.
• Industrial robustness: Rated for –40 °C to 100 °C operation to meet environmental demands of industrial deployments.
• Compact packaging: 1517‑FBGA (40 × 40) surface-mount package supports high-density PCB designs while maintaining thermal and mechanical reliability.
• Standards-conscious design: RoHS compliance supports environmentally conscious product lifecycles and regulatory requirements.

Why Choose EP2AGZ300HF40I4N?

The EP2AGZ300HF40I4N positions itself as a high-density, industrial-grade FPGA option within the Arria II GZ family. Its combination of nearly 298,000 logic elements, substantial embedded memory, and 734 I/Os makes it suitable for designers consolidating complex digital functions onto a single programmable device while meeting industrial environmental requirements.

Backed by Arria II family documentation and supplied in a compact 1517‑FBGA surface-mount package, this device offers a balance of integration, thermal tolerance, and board-level flexibility for customers building scalable, long-lived embedded systems.

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