EP2AGZ350FF35C4N

The EP2AGZ350FF35C4N is an Intel Arria II GZ Field Programmable Gate Array (FPGA) supplied in a 1152‑FBGA (35×35) package. This commercial‑grade device delivers high logic capacity and a large I/O complement in a surface‑mount package suited for complex, high‑density digital designs.

With substantial embedded memory and a defined core voltage range, the device is intended for applications that require sizable on‑chip resources and a compact BGA footprint while operating within standard commercial temperature limits.

Key Features

• Logic Capacity  Approximately 348,500 logic elements provide significant programmable logic resources for complex designs.
• Embedded Memory  Approximately 21.3 Mbits of on‑chip RAM (21,270,528 bits) for buffering, state storage, and local data processing.
• High I/O Count  554 user I/O pins support extensive peripheral, bus, and board‑level interfacing.
• Power/Core Supply  Core voltage specified from 870 mV to 930 mV, enabling predictable power planning for the FPGA core.
• Package & Mounting  1152‑pin FBGA/BBGA FCBGA package (35 × 35 mm) in a surface‑mount format for high‑density PCB designs.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial environments.
• Regulatory Compliance  RoHS‑compliant construction for regulatory and assembly compatibility.
• Manufacturer and Documentation  Part of the Intel Arria II GZ device family with detailed device handbook and datasheet documentation available from the manufacturer.

Unique Advantages

• High integration density: The large logic element count consolidates complex functions on‑chip, reducing external component count and board area.
• Substantial embedded memory: Approximately 21.3 Mbits of RAM supports on‑device buffering and data handling without immediate external memory dependencies.
• Extensive I/O capability: 554 I/O pins enable broad connectivity across peripherals, buses, and board interfaces without immediate expansion logic.
• Compact BGA package: The 1152‑pin FCBGA (35×35) package provides a high I/O and resource density in a compact surface‑mount form factor for space‑constrained PCBs.
• Predictable power envelope: Defined core supply range (870–930 mV) simplifies power‑supply design and thermal planning for the FPGA core.
• Commercial suitability: Rated for 0 °C to 85 °C and RoHS compliant for mainstream commercial product development and manufacturing.

Why Choose EP2AGZ350FF35C4N?

The EP2AGZ350FF35C4N positions itself as a high‑capacity Arria II GZ FPGA from Intel that balances large programmable logic, significant embedded memory, and a high I/O count within a compact 1152‑FBGA surface‑mount package. Its commercial temperature rating and RoHS compliance make it appropriate for a wide range of standard commercial electronics applications that need on‑chip resources and dense board integration.

Designers seeking a documented, manufacturer‑backed FPGA solution with clear electrical and package specifications will find this device suitable for consolidating functions on‑chip and simplifying board‑level integration while leveraging the Arria II family documentation for design and verification.

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