EP2AGZ350FF35I4

The EP2AGZ350FF35I4 is an Intel Arria II GZ Field Programmable Gate Array (FPGA) supplied in a 1152-ball BGA package for surface-mount assembly. It delivers high logic density, substantial on-chip memory, and broad I/O capability for industrial-grade programmable-logic designs.

With approximately 348,500 logic elements, about 21.27 Mbits of embedded memory, and 554 user I/O, this device is suited to applications that require dense logic resources, significant embedded RAM, and extensive external connectivity while operating over an industrial temperature range.

Key Features

• Logic Capacity  Approximately 348,500 logic elements (cells) to implement complex state machines, datapaths, and custom logic functions.
• Embedded Memory  Approximately 21.27 Mbits of on-chip RAM for buffering, FIFOs, and mapped data storage without external memory dependence.
• I/O Count  554 user I/O pins to support wide parallel interfaces, multiple serial buses, and diverse peripheral connections.
• Package & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) designed for surface-mount PCB assembly.
• Power Supply Range  Core operating supply specified from 870 mV to 930 mV to align with system power-rail designs.
• Industrial Temperature Grade  Qualified for operation from −40 °C to 100 °C for use in industrial environments.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• Industrial Control and Automation  Implement machine control logic, deterministic I/O handling, and embedded data buffering within the device’s industrial temperature range.
• Signal Processing and Prototyping  High logic density and substantial embedded RAM enable implementation of DSP pipelines, custom accelerators, and rapid hardware prototyping.
• Communications and Networking  Large I/O count and dense logic resources support packet processing, protocol handling, and interface bridging in communication equipment.
• High‑density Embedded Systems  On-chip memory and extensive logic resources let designers consolidate functions and reduce reliance on external components.

Unique Advantages

• High Logic Density:  Approximately 348,500 logic elements provide the capacity to integrate complex functions and reduce system-level component count.
• Significant On‑Chip Memory:  Around 21.27 Mbits of embedded RAM simplifies buffer and packet memory implementation without external SDRAM.
• Extensive I/O:  554 I/O pins give flexibility to connect multiple peripherals, parallel buses, and interface standards from a single device.
• Industrial Temperature Range:  Rated for −40 °C to 100 °C operation to meet industrial deployment requirements.
• Compact BGA Packaging:  1152-ball FCBGA (35×35) enables dense PCB layouts while supporting surface-mount assembly workflows.
• Regulatory Compliance:  RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP2AGZ350FF35I4?

The EP2AGZ350FF35I4 positions itself as an industrial-grade, high-density programmable logic device that balances logic capacity, embedded memory, and I/O connectivity in a compact BGA package. Its specified core voltage range and extended operating temperature make it appropriate for demanding embedded and industrial applications where on-chip resources reduce system complexity.

This FPGA is well suited to design teams and integrators who need a single-device solution for moderate-to-high complexity logic, on-chip buffering, and broad peripheral connectivity, while maintaining compliance with RoHS and industrial temperature requirements.

If you would like pricing, availability, or a formal quote for the EP2AGZ350FF35I4 Arria II GZ FPGA, submit a request and our team will respond with the next steps for procurement and delivery.