EP2AGZ350FH29C3N

The EP2AGZ350FH29C3N is an Intel Arria II GZ field programmable gate array (FPGA) supplied in a 780‑HBGA (33×33) FCBGA package. The device delivers high logic density and significant embedded RAM capacity for designs that require substantial on-chip resources.

Key device attributes include 348,500 logic elements, approximately 21.27 Mbits of embedded memory, 281 I/O pins, and a commercial operating temperature range of 0 °C to 85 °C. The core supply range is 870 mV to 930 mV and the device is RoHS compliant.

Key Features

• Core / Architecture  Arria II GZ family FPGA in the EP2AGZ350FH29C3N part variant, offering 348,500 logic elements for dense logic implementations.
• Embedded Memory  Total on-chip RAM of 21,270,528 bits (approximately 21.27 Mbits) to support buffering, state storage, and memory-intensive logic.
• I/O Capacity  281 I/O pins provide extensive external connectivity for interfaces and peripherals.
• Power  Core voltage supply range specified at 870 mV to 930 mV to match system power-rail requirements.
• Package & Mounting  Supplied in a 780-BBGA / 780-HBGA (33×33) FCBGA package with surface-mount mounting for board-level integration.
• Operating Range & Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density custom logic  Leverage 348,500 logic elements and embedded RAM to implement complex digital signal processing, state machines, and custom accelerators.
• Interface aggregation and bridging  Use the 281 I/O pins to consolidate and route multiple external interfaces on a single FPGA fabric.
• Embedded system prototyping  Surface-mount 780‑HBGA package and abundant on-chip resources make the device suitable for board-level prototypes and development platforms.

Unique Advantages

• High logic density: 348,500 logic elements enable large-scale integration of custom logic without external gate arrays.
• Substantial on-chip memory: Approximately 21.27 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O: 281 I/O pins allow flexible interfacing to peripherals, sensors, and external devices.
• Compact, board-ready package: 780‑HBGA (33×33) FCBGA surface-mount package supports compact PCB layouts and high-density assemblies.
• Commercial-grade operation: Rated for 0 °C to 85 °C, aligning with standard commercial system requirements.
• RoHS compliant: Meets common environmental compliance requirements for electronics manufacturing.

Why Choose EP2AGZ350FH29C3N?

The EP2AGZ350FH29C3N Arria II GZ FPGA combines significant logic capacity, on-chip memory, and broad I/O to address designs that demand dense programmable logic and embedded storage. Its commercial temperature rating and surface-mount 780‑HBGA package make it suitable for a wide range of board-level applications where integration density and on-chip resources are priorities.

Engineers can rely on the provided specifications—348,500 logic elements, approximately 21.27 Mbits of RAM, 281 I/Os, and a defined core voltage range—to evaluate system compatibility and power provisioning during design and procurement.

Request a quote or submit an inquiry for pricing and availability for EP2AGZ350FH29C3N to move your design forward with this Arria II GZ FPGA.