EP2AGZ350FF35I4N

The EP2AGZ350FF35I4N is an Arria II GZ family field‑programmable gate array delivered in a high‑density 1152‑FBGA (35×35) surface‑mount package. It provides a large logic fabric and sizable embedded memory for designs that require significant on‑chip logic, flexible I/O, and documented transceiver and timing characteristics in the device datasheet.

Specified as an industrial‑grade device, the part supports a core supply voltage range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C, making it suitable for long‑life embedded and industrial designs that need high integration and controlled operating conditions.

Key Features

• Logic Capacity  Approximately 348,500 logic elements for high‑density function implementation and complex logic integration.
• Embedded Memory  Approximately 21 Mbits of on‑chip RAM to support buffering, state storage, and embedded data structures without external memory for many use cases.
• I/O Resources  554 dedicated I/O pins to support broad peripheral connectivity and multi‑bank interfaces.
• Package and Mounting  1152‑BBGA / FCBGA family package; supplier device package listed as 1152‑FBGA (35×35). Designed for surface‑mount PCB assembly.
• Power  Core operating voltage specified between 870 mV and 930 mV, enabling predictable core power domain design.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for extended temperature operation.
• Device Datasheet Detail  Arria II device documentation includes electrical characteristics, transceiver performance specifications, and I/O timing (including programmable I/O element delay and programmable output buffer delay), supporting informed design integration.
• Compliance  RoHS compliant.

Typical Applications

• High‑density digital processing  Large logic capacity and embedded RAM make this part suitable for complex control, data path, and custom processing implementations.
• High‑performance I/O solutions  With 554 I/O pins and documented I/O timing and buffer delay parameters, the device fits applications requiring flexible, high‑pin‑count interfacing.
• Serial/transceiver‑based links  Device documentation includes transceiver performance specifications, enabling designs that incorporate high‑speed serial interfaces where supported by the Arria II GZ family.
• Industrial embedded systems  Industrial temperature rating and surface‑mount packaging are aligned with long‑lifecycle embedded applications operating across wide temperature ranges.

Unique Advantages

• High integration density:  348,500 logic elements and ~21 Mbits of embedded RAM allow substantial functionality to be implemented on a single device, simplifying board‑level design.
• Extensive I/O count:  554 I/O pins provide flexibility for multi‑port interfaces, peripheral expansion, and complex board interconnects.
• Documented performance data:  Datasheet includes detailed electrical, transceiver, and I/O timing characteristics to support accurate signal‑integrity and power design decisions.
• Industrial operating range:  Specified for −40 °C to 100 °C operation to meet the needs of temperature‑sensitive deployments.
• Predictable core power domain:  Core supply specified between 870 mV and 930 mV for straightforward power sequencing and budgeting.
• Regulatory compliance:  RoHS compliance supports environmental and regulatory requirements for electronic assemblies.

Why Choose EP2AGZ350FF35I4N?

The EP2AGZ350FF35I4N delivers a combination of high logic density, significant embedded RAM, and a large I/O count in a compact 1152‑FBGA surface‑mount package. Backed by comprehensive Arria II GZ family documentation covering electrical characteristics, transceiver performance, and I/O timing, this device enables engineering teams to design deterministic, high‑functionality systems while managing power and thermal considerations through its specified core voltage and industrial temperature range.

This part is appropriate for customers developing complex embedded logic, high‑pin‑count interface boards, or systems that benefit from on‑chip memory and documented transceiver/I/O behavior. Its industrial rating and RoHS compliance further support long‑lifecycle deployment scenarios.

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