EP2AGZ350FF35I3G

The EP2AGZ350FF35I3G is an Intel FPGA IC designed to provide high-density programmable logic and on-chip memory in a compact FCBGA package. It delivers a large number of logic elements and substantial embedded RAM, along with a wide I/O count and industrial temperature rating for demanding embedded applications.

Key on-chip resources and platform characteristics—such as approximately 348,500 logic elements, roughly 21.27 Mbits of embedded memory, 554 I/Os, and a 1152‑FBGA (35×35) package—enable integration of complex digital functions while maintaining a small board footprint.

Key Features

• Logic Capacity Approximately 348,500 logic elements to implement large-scale custom digital logic and parallel processing functions.
• Embedded Memory Approximately 21.27 Mbits of on-chip RAM to support buffering, data storage, and memory-intensive designs.
• High I/O Density 554 general-purpose I/O pins to support wide parallel interfaces, high-channel-count sensor or peripheral connectivity, and flexible board partitioning.
• Package and Mounting 1152‑FBGA (35×35) / 1152‑BBGA FCBGA package in a surface-mount form factor for compact integration and reliable soldered attachment.
• Power Supported core supply range from 870 mV to 930 mV for operation within specified low-voltage core rails.
• Temperature Range Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance RoHS compliant to meet regulatory and assembly requirements.

Unique Advantages

• Large programmable fabric: The high logic element count enables consolidation of multiple functions into a single device, reducing external components and board complexity.
• Significant embedded memory: Approximately 21.27 Mbits of on-chip RAM supports buffering and local data storage, minimizing external memory dependencies.
• Extensive I/O capability: 554 I/Os provide flexible interfacing options for parallel buses, sensor arrays, or high-channel-count systems.
• Compact FCBGA package: The 1152‑FBGA (35×35) package offers a high pin-count solution in a small footprint for space-constrained designs.
• Industrial temperature support: Rated from −40 °C to 100 °C for reliable operation across a wide ambient range.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and assembly.

Why Choose EP2AGZ350FF35I3G?

The EP2AGZ350FF35I3G positions itself as a high-capacity, industrial-grade FPGA option that combines extensive logic resources, sizable embedded memory, and broad I/O in a compact surface-mount FCBGA package. These attributes make it suitable for designs that require dense programmable logic integration while maintaining robust operating temperature and supply constraints.

For engineers and procurement teams seeking scalability and integration, this Intel FPGA offers verifiable on-chip resources and package characteristics that support consolidation of functions, potential BOM reduction, and deployment in industrial environments.

Request a quote or submit your requirements today to get pricing and availability for the EP2AGZ350FF35I3G.