EP2AGZ350FF35C4G

The EP2AGZ350FF35C4G is a commercial-grade Field Programmable Gate Array (FPGA) IC from Intel. It delivers a substantial logic capacity along with embedded memory and a large I/O count in a 1152-ball BGA/FBGA surface-mount package.

This device is suited for designs that require hundreds of thousands of logic elements, multiple megabits of on-chip RAM, and extensive I/O connectivity while operating within standard commercial temperature and voltage ranges.

Key Features

• Logic Capacity 348,500 logic elements provide a large fabric for implementing custom digital logic and complex processing pipelines.
• Embedded Memory Approximately 21.27 Mbits of on-chip RAM to support buffering, FIFOs, and small memory-mapped structures without external memory.
• I/O Density 554 I/O pins enable wide parallel interfacing, multiple peripherals, and flexible board-level connectivity.
• Power Supply Operates with a core voltage supply range of 0.870 V to 0.930 V as specified for the device.
• Package & Mounting Available in a 1152-ball BGA/FBGA package (supplier device package 1152-FBGA, 35×35) designed for surface-mount assembly.
• Operating Conditions Commercial operating temperature range from 0 °C to 85 °C and a commercial product grade designation.
• Regulatory Compliance RoHS compliant for lead-free manufacturing and assembly processes.

Typical Applications

• Custom Digital Logic and Prototyping — Implements complex state machines, protocol processors, and tailored digital functions using the device’s large logic element pool.
• Memory-Intensive Embedded Functions — Leverages approximately 21.27 Mbits of embedded RAM for buffering, packet processing, and local data storage without immediate reliance on external RAM.
• High-Density I/O Interfacing — Supports designs requiring many external signals or parallel interfaces through 554 available I/O pins.

Unique Advantages

• Substantial Logic Resources: 348,500 logic elements support complex or multi-function designs while consolidating discrete logic into a single device.
• Significant On-Chip Memory: Approximately 21.27 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary-storage needs.
• High I/O Count: 554 I/O pins increase board-level flexibility for parallel buses and multiple peripheral connections, simplifying routing and system partitioning.
• Compact Surface-Mount Package: 1152-ball BGA/FBGA packaging enables high-density board integration and standard SMT assembly processes.
• Commercial-Grade Operation: Designed for applications operating within 0 °C to 85 °C and supplied by a major manufacturer, suitable for a broad range of commercial products.
• RoHS Compliance: Supports lead-free manufacturing and regulatory requirements for many commercial markets.

Why Choose EP2AGZ350FF35C4G?

The EP2AGZ350FF35C4G balances a large logic fabric, multi-megabit embedded memory, and extensive I/O in a single surface-mount package, making it a practical choice for commercial designs that need integrated digital capability without multiple discrete components. Its specified voltage and temperature ranges and RoHS compliance match standard commercial manufacturing and deployment practices.

This Intel-manufactured FPGA is appropriate for engineers and procurement teams looking to consolidate functionality, reduce BOM complexity, and implement high-density digital designs that rely on substantial logic and local memory resources.

Request a quote or submit a procurement inquiry to receive pricing and availability information for EP2AGZ350FF35C4G.