EP2AGZ350FF35I3N

The EP2AGZ350FF35I3N is an Arria II GZ family FPGA in a 1152-ball FCBGA package, designed for high-density programmable logic and system integration. It provides a large logic fabric, substantial on-chip memory, and extensive I/O resources for demanding embedded and industrial applications.

Key value propositions include a high logic element count for complex designs, approximately 21.3 Mbits of embedded memory for data buffering and processing, and an industrial operating temperature range for deployment in temperature-challenging environments.

Key Features

• Core Logic  348,500 logic elements to implement large-scale digital designs and custom accelerators.
• Embedded Memory  Approximately 21.3 Mbits of on-chip RAM for frame buffering, packet queues, and intermediate data storage.
• I/O Capacity  554 general-purpose I/O pins to support wide-ranging peripheral, interface, and connectivity requirements.
• Power and Supply  Core supply range of 0.870 V to 0.930 V, enabling defined low-voltage core operation consistent with Arria II device requirements.
• Package and Mounting  1152-ball FCBGA (1152-FBGA, 35 × 35) in a surface-mount package for compact, high-density board designs.
• Thermal and Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for reliable operation in harsher environments.
• Environmental Compliance  RoHS compliant to meet common environmental regulatory requirements.

Typical Applications

• High-density programmable logic  Implement complex state machines, custom datapaths, and hardware accelerators using the 348,500 logic elements.
• Memory-intensive processing  Use the approximately 21.3 Mbits of embedded RAM for buffering, packet processing, or streaming data tasks.
• I/O-rich systems  Integrate multiple peripherals, buses, and interfaces leveraging up to 554 I/O pins for flexible board-level connectivity.
• Industrial control and instrumentation  Industrial grade and −40 °C to 100 °C operation make the device suitable for factory automation, motor control, and rugged instrumentation.

Unique Advantages

• High logic density: 348,500 logic elements enable consolidation of complex functions into a single device, reducing system BOM and board area.
• Substantial on-chip memory: Approximately 21.3 Mbits of embedded RAM supports latency-sensitive buffering and local data storage without external memory.
• Extensive I/O availability: 554 I/O pins provide design flexibility for multiple interfaces and parallel connections.
• Industry-grade reliability: Rated for −40 °C to 100 °C operation to withstand elevated and low-temperature deployments common in industrial systems.
• Compact FCBGA package: 1152-ball, 35 × 35 FCBGA package offers a dense footprint for high-performance board layouts while supporting surface-mount assembly.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP2AGZ350FF35I3N?

The EP2AGZ350FF35I3N brings together a large logic capacity, substantial embedded memory, and broad I/O in a compact FCBGA package tailored for industrial environments. Its specified core voltage range and RoHS compliance provide predictable electrical and manufacturing behavior for production designs.

This FPGA is suited to engineers and teams building high-density, I/O-rich systems that require sustained operation across a wide temperature range—reducing component count and enabling tighter integration for industrial applications and complex embedded systems.

Request a quote or submit your requirements to get pricing and availability for EP2AGZ350FF35I3N. Our team will respond with delivery lead times and ordering options tailored to your project needs.