EP2AGZ350FF35I3

The EP2AGZ350FF35I3 is an Intel Arria II GZ family field programmable gate array (FPGA) supplied in a 1152‑FBGA (35×35) surface‑mount package. It is offered as an industrial‑grade device and provides a balance of high logic capacity, embedded memory, and extensive I/O for demanding embedded and industrial applications.

With 348,500 logic elements, approximately 21.27 Mbits of on‑chip RAM and up to 554 user I/Os, this device targets designs that require substantial programmable logic, abundant internal memory, and a high pin count in a compact FCBGA footprint. The device operates from a core supply range of 0.870–0.930 V and is rated for −40 °C to 100 °C.

Key Features

• High logic capacity — 348,500 logic elements to implement complex custom logic, datapaths, and state machines.
• Embedded memory — Approximately 21.27 Mbits of on‑chip RAM for buffering, FIFOs, and memory‑intensive functions.
• Extensive I/O — Up to 554 user I/Os to support broad peripheral connectivity and multi‑interface systems.
• Industrial grade temperature range — Specified for operation from −40 °C to 100 °C for use in industrial environments.
• Low‑voltage core — Core supply range of 870 mV to 930 mV to match system power rails and control dynamic power.
• Compact high‑pin package — 1152‑FBGA (35×35) FCBGA package, surface‑mount, providing a high pin density in a space‑efficient form factor.
• Regulatory compliance — RoHS compliant for environmental and manufacturing conformity.

Typical Applications

• Industrial control and automation — Implement custom control logic, protocol bridging and I/O aggregation in factory and process control systems operating across industrial temperature ranges.
• High‑density embedded processing — Offload and accelerate application‑specific datapaths and state machines that require large logic and embedded memory resources.
• I/O‑rich system integration — Serve as a central programmable hub for interface consolidation, signal conditioning, and custom peripheral control where many I/Os are required.
• Prototyping and custom hardware — Evaluate and iterate complex logic designs that demand significant on‑chip resources and flexible packaging for integration into target hardware.

Unique Advantages

• Substantial fabric capacity: 348,500 logic elements enable large, complex designs without immediate migration to larger device families.
• Significant on‑chip memory: Approximately 21.27 Mbits of embedded RAM reduces the need for external memory in many buffering and stateful applications.
• High I/O count in a compact package: 554 user I/Os in a 1152‑FBGA (35×35) FCBGA footprint simplifies system routing and connector consolidation.
• Industrial temperature and RoHS compliance: Specified −40 °C to 100 °C operation and RoHS compliance support deployment in regulated industrial environments.
• Low‑voltage core operation: 0.870–0.930 V core supply enables integration with modern low‑voltage power architectures to manage overall system power.
• Surface‑mount FCBGA package: Facilitates automated PCB assembly and high‑density board designs.

Why Choose EP2AGZ350FF35I3?

The EP2AGZ350FF35I3 combines high logic density, substantial embedded memory, and a large number of user I/Os in a compact 1152‑FBGA package, making it well suited for industrial and embedded designs that demand on‑chip resources and wide connectivity. Its industrial temperature rating and RoHS compliance further align it to long‑lifecycle installations.

As a member of the Arria II GZ device family from Intel, this FPGA is positioned for designers who require scalable programmable logic capacity, robust on‑chip memory, and a high‑pin‑count package for system integration in industrial applications.

If you would like pricing, availability, or a formal quote for EP2AGZ350FF35I3, submit a request for a quote or contact sales to receive detailed pricing and lead‑time information.