EP2AGZ350FF35C3N

The EP2AGZ350FF35C3N is an Arria II GZ family field programmable gate array (FPGA) in a 1152-ball BGA FCBGA package. It delivers large programmable logic capacity, substantial on-chip memory, and a high count of I/O pins for designs that require dense integration and flexible interfacing.

Designed for commercial-grade applications, this device provides 348,500 logic elements, approximately 21.27 Mbits of embedded memory, and 554 I/O pins, making it suitable for complex digital designs that need broad I/O and significant embedded RAM.

Key Features

• Logic Capacity 348,500 logic elements to implement complex, large-scale digital functions and custom logic architectures.
• Embedded Memory Approximately 21.27 Mbits of on-chip RAM for buffering, data storage, and memory-intensive processing tasks.
• High I/O Count 554 available I/O pins to support wide data buses, parallel interfaces, and extensive peripheral connections.
• Package & Mounting 1152-ball BGA (FCBGA) package, supplier device package 1152-FBGA (35×35), designed for surface-mount PCB assembly and compact system integration.
• Power/Voltage Core supply voltage range specified at 870 mV to 930 mV to match low-voltage core power domains.
• Operating Range & Grade Commercial-grade device rated for 0 °C to 85 °C operating temperature; RoHS compliant.
• Family-Level Capabilities Arria II device handbook notes support for device electrical and switching characteristics including transceiver performance, I/O timing, and PLLs relevant to the Arria II family.

Typical Applications

• High-density digital processing — Implement complex logic, state machines, and custom datapaths using the device's large logic element count and embedded memory.
• Broad I/O interfacing — Use the 554 I/O pins for wide parallel buses, multi-channel I/O, or mixed-signal front-end connectivity where many external connections are required.
• FPGA-based prototyping and system integration — Rapidly evaluate and integrate custom hardware functions in compact, surface-mount form factors.

Unique Advantages

• Large programmable fabric: 348,500 logic elements enable implementation of extensive custom logic without immediate need for external ASICs or coprocessors.
• Substantial on-chip RAM: Approximately 21.27 Mbits of embedded memory reduces dependence on external memory for buffering and local data storage.
• Extensive I/O: 554 I/O pins provide flexibility for complex interfacing and multi-channel connectivity in dense designs.
• Compact, manufacturable package: 1152-ball FCBGA (35×35) supports surface-mount assembly and high-density PCB layouts.
• Commercial temperature rating and RoHS compliance: 0 °C to 85 °C operating range and RoHS compliance support standard commercial production and regulatory needs.
• Defined core supply range: Core voltage specification (870–930 mV) supports integration with low-voltage power domains.

Why Choose EP2AGZ350FF35C3N?

The EP2AGZ350FF35C3N provides a high-capacity Arria II GZ FPGA option for commercial designs that require a large logic fabric, significant on-chip RAM, and a high number of I/O connections in a compact FCBGA package. Its defined electrical characteristics and family-level documentation around I/O timing and transceiver performance make it appropriate for developers who need predictable behavior and integration within Arria II-based designs.

This part is suited to engineering teams building complex digital systems, prototypes, or integration platforms where on-chip memory and extensive I/O reduce external component count and simplify board-level architecture. RoHS compliance and commercial operating specifications support standard production deployments.

Request a quote or submit an inquiry for availability and pricing of EP2AGZ350FF35C3N to begin evaluating this Arria II GZ FPGA for your next design.