EP2AGZ300HF40I4

IC FPGA 11920 I/O 1517FBGA
Part Description

Arria II GZ Field Programmable Gate Array (FPGA) IC 11920 18854912 1517-BBGA, FCBGA

Quantity 276 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O734Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs298000Number of Logic Elements/Cells298000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits18854912

Overview of EP2AGZ300HF40I4 – Arria II GZ FPGA, 298000 logic elements, ~18.85 Mbit RAM, 734 I/Os, 1517-BBGA FCBGA

The EP2AGZ300HF40I4 is an Arria II GZ field programmable gate array (FPGA) in a 1517-BBGA FCBGA package designed for industrial applications. It combines a 40-nm low-power FPGA engine and a high-count logic fabric with substantial embedded memory and I/O capacity for designs that require dense logic, on-chip memory, and extensive external interfacing.

Targeted at high-bandwidth interfaces, signal processing, and industrial control systems, this device offers a balance of integration, configurable I/O, and temperature robustness for demanding environments.

Key Features

  • Core Architecture 40-nm low-power FPGA engine with adaptive logic modules and eight-input fracturable look-up tables for efficient logic implementation as described for the Arria II family.
  • Logic Capacity 298000 logic elements to implement complex custom logic and control functions on-chip.
  • Embedded Memory Approximately 18.85 Mbits of embedded memory (18,854,912 total RAM bits) for frame buffers, FIFOs, and local data storage.
  • DSP and Arithmetic Resources Family-level DSP blocks and hardcoded add/subtract/accumulate functions support common signal-processing tasks; Arria II devices include high-performance DSP blocks suitable for complex math operations.
  • I/O Capacity & Flexibility 734 user I/Os with support for a wide range of single-ended and differential I/O standards (Arria II family I/O versatility noted in the device handbook).
  • High-speed Serial Support Arria II family features include transceiver support and dedicated circuitry for common serial protocols and high-speed links (family-level capabilities include CDR-based transceivers and protocol support).
  • Power and Supply Operates from a core voltage supply range of 870 mV to 930 mV and incorporates architectural power reduction techniques described for the Arria II family.
  • Package & Mounting 1517-BBGA (FCBGA) package, supplier device package noted as 1517-FBGA (40×40); surface-mount mounting type for typical PCB assembly flows.
  • Industrial Temperature Grade Rated for an operating temperature range of −40 °C to 100 °C and specified as Industrial grade for temperature-sensitive deployments.
  • Security & Configuration Arria II family supports 256-bit AES programming file encryption and on-chip configuration options for design security and flexible configuration flows.

Typical Applications

  • Network & Telecom Infrastructure — Implement high-bandwidth interfaces and protocol handling using the device’s dense logic, embedded memory, and family-level transceiver capabilities.
  • Data Acquisition & Signal Processing — Leverage on-chip DSP resources and approximately 18.85 Mbits of memory for real-time filtering, buffering, and algorithm acceleration.
  • Industrial Control & Automation — Industrial temperature range and large I/O count enable rugged control, motor drive logic, and extensive sensor interfacing.
  • Storage & Connectivity Bridges — Use the I/O flexibility and embedded logic to implement protocol bridging, custom PHY interfaces, and peripheral controllers.

Unique Advantages

  • High Integration Density: 298000 logic elements and substantial embedded memory consolidate logic and buffering on-chip, reducing external component requirements.
  • Extensive I/O Resources: 734 user I/Os provide broad interfacing options for parallel buses, GPIO arrays, and mixed-signal front-ends.
  • Industrial Reliability: Industrial grade device rating with −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
  • Power-aware Design: 40-nm low-power FPGA architecture and documented power-optimization techniques support constrained power budgets; core supply specified at 870–930 mV.
  • On-chip DSP and Memory: Integrated DSP blocks and approximately 18.85 Mbits of RAM enable efficient implementation of signal-processing pipelines without heavy reliance on external memory.
  • Security & Configuration Options: Support for AES programming file encryption and multiple configuration modes enhances design security and flexibility.

Why Choose EP2AGZ300HF40I4?

The EP2AGZ300HF40I4 delivers a high-capacity, industrial-grade FPGA solution that balances logic density, embedded memory, and extensive I/O for demanding applications. Backed by Arria II family architecture and the associated development ecosystem, it is suited for designers building high-bandwidth interfaces, signal-processing engines, and rugged industrial systems.

Choose this device when you need a scalable, configurable platform that brings on-chip DSP, sizable embedded memory, and flexible I/O into a single surface-mount FCBGA package within an industrial temperature envelope.

Request a quote or submit a purchase inquiry today to evaluate EP2AGZ300HF40I4 for your next design.

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