EP2AGZ300HF40I3N

The EP2AGZ300HF40I3N is an Arria II GZ field-programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA (40×40) surface-mount package. This industrial-grade device combines a high logic capacity and substantial on-chip memory with a large I/O count to address complex embedded, communications, and high-density interfacing applications.

Designed for systems that require dense programmable logic and flexible I/O, the device delivers 298,000 logic elements, approximately 18.85 Mbits of embedded memory, and up to 734 user I/O pins while operating across a broad industrial temperature range.

Key Features

• Logic Capacity — 298,000 logic elements provide substantial resources for implementing large digital designs and custom accelerators.
• Logic Array Blocks — 11,920 logic array blocks for structured logic grouping and resource partitioning.
• Embedded Memory — Approximately 18.85 Mbits of on-chip RAM to support buffering, packet processing, and local data storage without external memory.
• High I/O Count — 734 I/O pins to accommodate multiple parallel interfaces, wide buses, and mixed-signal front-ends.
• Power Supply Range — Specified operating voltage supply range of 870 mV to 930 mV, suitable for the device’s core power requirements.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Package & Mounting — 1517-BBGA FCBGA (40×40) surface-mount package for high-density board designs and reliable solder attachment.
• Standards Compliance — RoHS compliant.

Typical Applications

• High-density networking and communications — Large logic capacity and ample on-chip RAM are suited for packet processing, protocol offload, and aggregation functions.
• Signal processing and instrumentation — High I/O count and extensive logic resources enable multi-channel data acquisition, preprocessing, and real-time filtering.
• Embedded compute acceleration — Use as a customizable hardware accelerator where dense logic and local memory reduce latency and external memory bandwidth.
• Industrial control systems — Industrial temperature rating and robust packaging support deployment in factory automation and process-control environments.

Unique Advantages

• Large programmable fabric: 298,000 logic elements enable integration of complex functions on a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 18.85 Mbits of RAM minimizes dependence on external memory for many buffering and state-storage tasks.
• Extensive I/O connectivity: 734 I/O pins provide flexibility to interface with multiple peripherals, sensors, and high-speed links concurrently.
• Industrial operation: Rated from –40 °C to 100 °C, allowing use in temperature-challenging environments common to industrial deployments.
• Densely packaged: 1517-BBGA (40×40) surface-mount package supports high-density PCB layouts while maintaining a robust soldered connection.
• Regulatory compliance: RoHS compliance supports environmentally conscious product designs and supply-chain requirements.

Why Choose EP2AGZ300HF40I3N?

The EP2AGZ300HF40I3N positions itself where high logic density, significant embedded memory, and broad I/O capability are required in an industrial-grade FPGA. Its combination of 298,000 logic elements, approximately 18.85 Mbits of on-chip RAM, and 734 I/Os makes it suitable for complex embedded systems, communications equipment, and industrial automation designs that demand programmable flexibility and reliable operation across a wide temperature range.

For design teams seeking to consolidate functionality, reduce external components, and maintain robust operation in industrial conditions, this Arria II GZ device offers a balanced mix of density, I/O, and thermal tolerance backed by documented device specifications.

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