EP2AGZ300HF40C3N

The EP2AGZ300HF40C3N is an Intel Arria II GZ family FPGA in a 1517‑BBGA FCBGA package optimized for high‑density digital designs. It delivers 298,000 logic elements, 734 user I/Os, and approximately 18.85 Mbits of embedded RAM in a surface‑mount 1517‑FBGA (40×40) supplier package.

Designed for commercial‑grade applications, this device targets systems that require large logic capacity, significant on‑chip memory, and high I/O count while operating from a core supply of 870 mV to 930 mV and across a 0 °C to 85 °C temperature range.

Key Features

• Core Logic  298,000 logic elements provide extensive programmable resources for complex digital designs and custom logic implementations.
• Embedded Memory  Approximately 18.85 Mbits of on‑chip RAM to support buffering, state machines, and data‑intensive logic without external memory.
• I/O Capacity  734 I/O pins for large, multi‑interface systems requiring many external connections.
• Power Supply  Core voltage support from 870 mV to 930 mV to match system rail planning and power budgeting requirements.
• Package & Mounting  1517‑BBGA (FCBGA) package; supplier device package specified as 1517‑FBGA (40×40); surface‑mount mounting type for compact PCB integration.
• Operating Conditions & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS compliant for regulatory alignment in standard commercial electronics manufacturing.
• Documentation  Covered by the Arria II device handbook and device datasheet/addendum for electrical and switching characteristics, I/O timing, and device operating requirements.

Typical Applications

• Complex Digital Systems  Use the large pool of logic elements and embedded RAM for custom datapaths, state machines, and system controllers.
• High‑I/O Interface Hubs  734 I/Os enable dense connectivity for protocol bridging, multi‑port I/O aggregation, and subsystem interfacing.
• Signal Processing and Acceleration  On‑chip memory and extensive logic resources support streaming data tasks and custom compute blocks within commercial products.
• Prototyping and System Integration  Surface‑mount FCBGA packaging and a comprehensive device handbook make the device suitable for board‑level integration and system proof‑of‑concepts.

Unique Advantages

• High Logic Density: 298,000 logic elements enable consolidation of functions that would otherwise require multiple devices, reducing BOM complexity.
• Substantial On‑Chip Memory: Approximately 18.85 Mbits of embedded RAM allow significant buffering and local storage without immediate dependence on external memory.
• Extensive I/O Count: 734 I/Os provide flexibility for multi‑channel interfaces, sensor arrays, and mixed‑signal system interconnects.
• Compact, Surface‑Mount Package: 1517‑BBGA FCBGA (supplier 1517‑FBGA 40×40) enables dense PCB layouts and space‑constrained designs.
• Low‑Voltage Core Support: Core supply range of 870 mV to 930 mV aligns with modern low‑voltage power architectures.
• Commercial‑Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial electronics.

Why Choose EP2AGZ300HF40C3N?

The EP2AGZ300HF40C3N positions itself as a high‑capacity FPGA option within the Intel Arria II GZ family, combining hundreds of thousands of logic elements, multi‑megabit on‑chip memory, and a large I/O complement in a compact FCBGA package. Its commercial temperature rating and RoHS compliance make it appropriate for mainstream embedded and system designs that require significant programmable logic and connectivity.

This device is suited to engineering teams and procurement organizations building complex digital subsystems, I/O‑dense controllers, and memory‑intensive logic blocks where integration density and documented device behavior (per the Arria II device handbook and datasheet) are important factors.

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