EP2AGZ300FH29I3N

The EP2AGZ300FH29I3N is an Intel Arria II GZ field-programmable gate array (FPGA) in a 780‑ball BGA package designed for industrial-grade embedded systems. It combines high logic density, substantial on-chip memory, and a broad I/O complement to address mid-to-high density programmable-logic requirements.

With industrial temperature grading and a tight core voltage range, this device is intended for designs that require robust operation across extended environmental conditions while delivering significant integration for control, interface, and processing tasks.

Key Features

• Logic Capacity — Provides 298,000 logic elements to support complex FPGA designs and high-density logic implementations.
• Logic Blocks — Includes 11,920 logic blocks as specified for partitioning and structured logic use.
• Embedded Memory — Approximately 18.85 Mbits of on-chip RAM to support buffering, packet processing, or embedded data storage.
• I/O Resources — 281 user I/O pins to enable wide peripheral connectivity and multi-interface designs.
• Power Supply — Core supply voltage range of 870 mV to 930 mV for defined power and timing behavior.
• Package and Mounting — 780‑BBGA (FCBGA) package; supplier device package listed as 780‑HBGA (33×33); surface-mount mounting type for standard PCB assembly.
• Industrial Grade and Temperature Range — Rated industrial grade with operating temperature from −40 °C to 100 °C for deployment in harsh environments.
• Regulatory Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Automation: FPGA logic density and industrial temperature rating suit control, motor drive, and factory-automation systems requiring reliable operation over wide temperatures.
• High‑Density Embedded Systems: Large logic and memory resources enable embedded compute tasks, real-time processing, and complex state machines.
• Interface and I/O Bridging: 281 I/O pins provide flexibility for bridging multiple interfaces, sensor arrays, and mixed-signal front ends.

Unique Advantages

• Substantial Logic Resources: 298,000 logic elements reduce the need for multiple devices, simplifying system architecture.
• On‑Chip Memory: Approximately 18.85 Mbits of embedded RAM supports data buffering and deterministic on-device storage without external memory.
• Industrial Robustness: Industrial grade and −40 °C to 100 °C operating range enable deployment in challenging environmental conditions.
• Flexible I/O Count: 281 I/O pins support diverse peripheral and interface configurations, minimizing additional I/O expanders.
• Compact BGA Packaging: 780‑BBGA (33×33 supplier package) delivers high density in a surface-mount form factor suitable for space-constrained PCBs.
• Standards-Aligned Compliance: RoHS compliance supports environmentally restricted markets and production requirements.

Why Choose EP2AGZ300FH29I3N?

The EP2AGZ300FH29I3N positions itself as a high-density, industrial-grade FPGA option that balances large logic and memory resources with a generous I/O count and a robust operating temperature window. These characteristics make it appropriate for engineers designing compact, reliable embedded systems that require significant on-chip programmability.

Backed by Intel's Arria II device family documentation and consistent electrical specifications, the device is a practical choice for designs where integration, deterministic on-chip resources, and industrial reliability are priorities.

If you require pricing, availability, or technical clarification, request a quote or submit an RFQ to initiate procurement and receive detailed lead-time and ordering information.