EP2AGZ300FH29C4N

The EP2AGZ300FH29C4N is an Arria II GZ field-programmable gate array (FPGA) from Intel, supplied in a 780‑ball BGA FCBGA package. It provides a high-density programmable fabric with on-chip embedded memory and a large I/O count for designs that require substantial logic capacity and system-level integration.

This commercial-grade device supports a core voltage supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C, offering a balance of performance and standard commercial-environment reliability.

Key Features

• High-density fabric  298,000 logic elements for implementing complex logic, large state machines, and high-integration system functions.
• Embedded memory  Approximately 18.85 Mbits of on-chip RAM to support buffering, FIFOs, and localized data storage without external memory for many functions.
• Generous I/O  281 user I/O pins to support wide parallel interfaces, multiple subsystems, and high-pin-count peripheral connectivity.
• Power envelope  Core supply operation from 870 mV to 930 mV to match system power-rail constraints and enable predictable power planning.
• Package & mounting  780‑ball BGA (FCBGA) surface-mount package (supplier package: 780‑HBGA, 33×33) for compact board-level integration.
• Commercial grade & thermal  Rated for 0 °C to 85 °C operation for standard commercial applications.
• Regulatory  RoHS compliant.
• Arria II family documentation  Device electrical characteristics, I/O timing, and transceiver performance specifications are provided in the Arria II device handbook and accompanying datasheet material.

Typical Applications

• High-density logic implementations  Use the 298,000 logic elements to consolidate complex digital functions and reduce external components in system designs.
• I/O‑intensive interfaces  Leverage 281 I/Os for designs requiring multiple parallel buses, wide data paths, or numerous peripheral connections.
• On-chip buffering and data handling  Approximately 18.85 Mbits of embedded memory supports local buffering, packet processing queues, and temporary storage for streaming data.
• Compact board-level systems  780‑ball FCBGA packaging enables dense PCB layouts for space-constrained commercial applications.

Unique Advantages

• Large programmable capacity: 298,000 logic elements provide room for substantial feature sets and logic consolidation.
• Significant embedded memory: Approximately 18.85 Mbits of on-chip RAM reduces reliance on external DRAM for many buffering and storage tasks.
• High I/O count: 281 I/O pins allow flexible interfacing with multiple subsystems and peripherals without extensive board-level multiplexing.
• Commercial operating range: 0 °C to 85 °C rating aligns with standard commercial deployments and system thermal budgets.
• Compact BGA package: 780‑ball FCBGA (33×33) supports high-density PCB integration while maintaining signal routing options.
• RoHS compliant: Meets common environmental compliance requirements for commercial electronics.

Why Choose EP2AGZ300FH29C4N?

The EP2AGZ300FH29C4N positions itself as a high-capacity, commercially rated FPGA option within the Arria II GZ family. With 298,000 logic elements, substantial on-chip memory, and 281 I/Os in a compact 780‑ball BGA package, it is suitable for designers who need to integrate complex digital functions and substantial data buffering while conserving board space.

Backed by Arria II device documentation and supplied by Intel, this device is appropriate for teams building commercial embedded systems where logic capacity, I/O flexibility, and on-chip memory are primary selection criteria.

Request a quote or submit an inquiry to evaluate EP2AGZ300FH29C4N for your design and receive pricing and availability information.