EP2AGZ300FH29I3G

The EP2AGZ300FH29I3G is an Intel-manufactured Field Programmable Gate Array (FPGA) IC designed for industrial applications. It combines a high count of logic elements and substantial on-chip memory in a 780-ball BGA package to support configurable digital designs.

Key attributes include approximately 298,000 logic elements, roughly 18 Mbits of embedded memory, 281 I/O pins, and an industrial operating temperature range, making it suitable for robust, programmable system implementations.

Key Features

• Logic Density  Approximately 298,000 logic elements provide substantial capacity for complex combinational and sequential logic implementations.
• Configurable Logic Blocks (CLBs)  11,920 CLBs (as reported) for distributed logic and fine-grained resource mapping.
• Embedded Memory  Approximately 18 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
• I/O Capability  281 I/O pins to support a wide range of external interfaces and signal routing in system designs.
• Power Supply  Specified core voltage range of 870 mV to 930 mV for the device supply domain.
• Package & Mounting  780-ball FCBGA (supplier package: 780-HBGA, 33×33) intended for surface-mount PCB integration.
• Operating Conditions & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C and RoHS compliant.

Typical Applications

• Programmable logic integration  Use the FPGA to implement custom digital logic, glue functions, and protocol bridges within larger systems.
• Embedded memory-centric designs  Leverage the approximately 18 Mbits of on-chip RAM for buffering, LUT storage, and local data handling.
• High-pin-count interfacing  Deploy the 281 I/O pins for multi-channel I/O, control planes, and peripheral connectivity.

Unique Advantages

• High logic capacity: The large count of logic elements enables integration of complex algorithms and substantial gate counts on a single device, reducing external component needs.
• On-chip memory resources: Roughly 18 Mbits of embedded RAM reduce dependence on external SDRAM for many buffering and storage tasks, simplifying system design.
• Industrial temperature range: Rated from −40 °C to 100 °C for deployment in thermally demanding environments where extended temperature operation is required.
• Compact BGA package: The 780-ball FCBGA / 780-HBGA (33×33) package provides a dense footprint for space-constrained boards while supporting surface-mount assembly.
• Design flexibility: A broad I/O count and configurable logic resources allow architectural tailoring to application needs without changing hardware platforms.
• Regulatory compliance: RoHS-compliant construction supports environmentally constrained manufacturing requirements.

Why Choose EP2AGZ300FH29I3G?

EP2AGZ300FH29I3G positions itself as an industrial-grade FPGA option with substantial logic density, significant embedded memory, and a high I/O count in a compact BGA package. The combination of these measurable specifications supports integration of complex digital functions and memory-intensive tasks on a single device.

This device is appropriate for teams and designs that require a programmable, high-capacity logic element with robust operating-temperature capability and surface-mount packaging for production PCBs. Sourcing this Intel FPGA can help maintain design flexibility while leveraging the device’s on-chip resources to streamline bill-of-materials and board-level complexity.

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