EP2AGZ300HF40C3G

The EP2AGZ300HF40C3G is a Field Programmable Gate Array (FPGA) IC from Intel, delivering a high-capacity programmable fabric for custom digital logic. It combines a large number of logic elements with substantial on-chip memory and a high I/O count to support complex designs that require integration and flexibility.

Key Features

• Logic Capacity  Approximately 298,000 logic elements to implement complex custom logic and parallel processing functions.
• Embedded Memory  Approximately 18.85 Mbits of on-chip RAM to support buffering, state machines, and on-chip data storage without immediate reliance on external memory.
• I/O Density  734 user I/O pins to support wide peripheral connectivity and high-pin-count interfaces directly from the FPGA.
• Power  Core supply range of 870 mV to 930 mV for the device core power domain, enabling designs that target this low-voltage operating window.
• Package and Mounting  Available in a 1517-FBGA (40×40) FCBGA package with surface-mount mounting for compact board integration.
• Operating Range and Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to meet standard environmental requirements for electronics manufacturing.

Unique Advantages

• High integration: Large logic element count and substantial embedded RAM reduce the need for external logic and memory, simplifying board-level BOM.
• High I/O capacity: 734 I/Os accommodate multiple parallel interfaces, sensors, and peripherals without external multiplexing.
• Compact package: 1517-FBGA (40×40) surface-mount package enables dense system layouts and supports compact form-factor designs.
• Low-voltage core operation: 870–930 mV core supply supports designs targeting lower core power domains.
• Commercial temperature rating: 0 °C to 85 °C operation matches standard commercial electronics environments and production requirements.
• RoHS compliant: Conforms to standard environmental regulations for lead-free manufacturing processes.

Why Choose EP2AGZ300HF40C3G?

The EP2AGZ300HF40C3G positions itself as a high-capacity, commercially graded FPGA for designers who need extensive programmable logic, significant on-chip memory, and a large number of I/Os in a compact BGA package. Its combination of approximately 298,000 logic elements, roughly 18.85 Mbits of embedded RAM, and 734 I/Os makes it suitable for complex digital designs where integration and I/O density are priorities.

As an Intel FPGA device in a 1517-FBGA (40×40) surface-mount package with RoHS compliance and a 0 °C to 85 °C operating range, it offers a balance of capacity, integration, and manufacturability for commercial embedded and system designs that require programmable hardware resources.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for EP2AGZ300HF40C3G.