EP2AGZ300FH29C3N

The EP2AGZ300FH29C3N is an Arria II GZ field programmable gate array supplied in a 780-BBGA FCBGA package for surface-mount applications. It delivers a high-density programmable fabric with substantial on-chip memory and a large I/O complement targeted at commercial-grade embedded and digital designs.

This device is part of the Arria II device family (which includes Arria II GX and GZ devices) and is specified for commercial operation with documented electrical and operating characteristics in the device datasheet.

Key Features

• High logic density — 298,000 logic elements to implement complex digital functions and custom logic architectures.
• Embedded memory — approximately 18.85 Mbits of on-chip RAM for buffering, LUTs, and local storage.
• Generous I/O count — 281 I/O pins to support rich external interfacing and parallel connectivity.
• Package and mounting — 780-BBGA (FCBGA) package, supplier device package 780-HBGA (33×33); surface-mount form factor for compact board designs.
• Core supply range — specified voltage supply from 870 mV to 930 mV for the device core.
• Commercial temperature grade — rated for operation from 0 °C to 85 °C.
• RoHS compliant — conforms to RoHS environmental requirements.

Typical Applications

• High-density digital designs — implementing complex state machines, datapaths, and custom logic functions leveraging the device's large logic element count.
• Memory-intensive embedded functions — on-chip RAM resources support buffering, packet processing, and local data storage without immediate reliance on external memory.
• I/O-rich systems — multi-signal interfaces and sensor aggregation where a high pin count simplifies board routing and reduces external glue logic.
• Compact embedded platforms — the FCBGA package and surface-mount mounting suit space-constrained boards that require substantial programmable logic.

Unique Advantages

• Substantial on-chip resources: Large logic element count and embedded memory reduce the need for additional discrete ICs and simplify system architecture.
• High I/O flexibility: 281 I/Os enable diverse external interfaces and parallel connectivity options for system-level integration.
• Compact package: 780-BBGA (33×33 supplier package) supports dense board layouts while maintaining performance.
• Low-voltage core operation: Core supply specified between 870 mV and 930 mV supports efficient power delivery for the programmable fabric.
• Commercial-grade reliability: Specified operating range of 0 °C to 85 °C and RoHS compliance align with commercial product requirements.

Why Choose EP2AGZ300FH29C3N?

The EP2AGZ300FH29C3N combines high logic density, significant embedded memory, and a large I/O count in a compact FCBGA package, making it well suited for commercial embedded systems that require programmable customization and on-board data handling. Its defined core voltage range and commercial operating temperature make it straightforward to integrate into standard supply domains and thermal designs.

This device is appropriate for engineers and procurement teams developing mid- to high-complexity digital systems who need a programmable solution with verified electrical characteristics and RoHS compliance.

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