EP2AGZ300FF35I4G

The EP2AGZ300FF35I4G is an Intel Field Programmable Gate Array (FPGA) IC designed for demanding embedded and industrial applications. It combines a large logic capacity, substantial on-chip memory, and a high I/O count to support complex, configurable digital designs.

Key platform attributes include 298,000 logic elements, approximately 18.85 Mbits of embedded memory, 554 I/O pins, and industrial-grade operational range (−40 °C to 100 °C), with a supply voltage window of 870 mV to 930 mV. The device is supplied in a 1152-FBGA (35×35) package and is RoHS compliant.

Key Features

• Core / Logic 298,000 logic elements for implementing large-scale programmable logic and complex custom functions.
• Embedded Memory Approximately 18.85 Mbits of on-chip RAM to support buffering, packet processing, lookup tables and other memory-intensive tasks.
• I/O Density 554 user I/O pins to accommodate broad interfacing needs and multiple parallel interfaces.
• Power Operates across a supply voltage range of 870 mV to 930 mV, enabling designs that require this specific core voltage window.
• Package & Mounting 1152-FBGA (35×35) package (supplier device package: 1152-FBGA) with surface-mount construction for high-density board integration.
• Temperature & Grade Industrial-grade device with specified operating temperature from −40 °C to 100 °C for use in temperature-demanding environments.
• Compliance RoHS compliant for regulatory and environmental conformity.

Typical Applications

• Industrial Control Systems — Implement complex control logic, I/O aggregation, and real-time processing using the device's high logic capacity and industrial temperature range.
• Communications Equipment — Support protocol handling, packet processing, and interface routing where large on-chip memory and many I/Os are required.
• Data Acquisition & Processing — Buffering and pre-processing of high-channel-count sensor data using abundant embedded RAM and extensive I/O.
• Prototyping and System Integration — Integrate multiple subsystems and validate custom digital functions on a single programmable device.

Unique Advantages

• High logic capacity: 298,000 logic elements provide the space to implement complex algorithms, custom accelerators, and large state machines without partitioning across multiple devices.
• Significant on-chip memory: Approximately 18.85 Mbits of embedded RAM reduces external memory dependency and accelerates data-path implementations.
• Extensive I/O connectivity: 554 I/O pins enable wide parallel interfaces and flexible system interconnection options.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in harsher operating environments.
• Standard surface-mount FBGA package: 1152-FBGA (35×35) supports compact, high-density PCB layouts and standard assembly processes.
• Regulatory alignment: RoHS compliance supports environmental and regulatory requirements.

Why Choose EP2AGZ300FF35I4G?

The EP2AGZ300FF35I4G offers a combination of substantial logic resources, embedded memory, and I/O capacity intended for industrial designs that require programmable flexibility and robust operation across a wide temperature range. Its package and mounting are suited for compact, high-density board-level integration.

Engineers and system designers who need a programmable device with high logic density, ample on-chip RAM, and a large number of I/Os will find this Intel FPGA suitable for scalable designs that demand configurable hardware and durable operation.

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