EP2AGZ300FF35C4G

The EP2AGZ300FF35C4G is a Field Programmable Gate Array (FPGA) IC from Intel, offered in a surface-mount FCBGA package. It delivers high logic density with 298,000 logic elements, approximately 18.85 Mbits of embedded memory, and a large 554-pin I/O complement for complex digital designs.

Designed for commercial-grade applications, this device operates from a core supply of 870 mV to 930 mV and across an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and supplied in a 1152-FBGA (35×35) package for compact board-level integration.

Key Features

• Logic Capacity  298,000 logic elements support complex programmable logic and substantial on-chip design integration.
• Embedded Memory  Approximately 18.85 Mbits of total RAM bits available for buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Resources  554 I/O pins provide extensive external connectivity for multi-channel interfaces and system-level integration.
• Package & Mounting  Surface-mount 1152-FBGA (35×35) FCBGA package enables dense board layouts and reliable soldered connections.
• Power  Core supply operating range from 870 mV to 930 mV for defined power budgeting and system-level power planning.
• Operating Range  Commercial-grade operating temperature range of 0 °C to 85 °C suitable for standard commercial electronics environments.
• Environmental Compliance  RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

• I/O-Intensive Systems  High pin count (554 I/Os) supports multi-interface hubs, data aggregation, and systems requiring many external connections.
• High-Density Digital Processing  Large logic element count enables implementation of complex custom logic, parallel processing, and custom datapath accelerators.
• On-Chip Memory Buffering  Approximately 18.85 Mbits of embedded memory supports buffering, FIFOs, and local data storage to reduce external memory dependence.
• Compact Board Designs  1152-FBGA package and surface-mount mounting facilitate compact, soldered implementations for space-constrained applications.

Unique Advantages

• Highly Integrated Solution: Combines 298,000 logic elements with substantial embedded memory to consolidate functions that might otherwise require multiple components.
• Extensive I/O Availability: 554 I/Os enable integration of multiple interfaces and parallel channels without external expander chips.
• Defined Power Envelope: Core supply range of 870 mV to 930 mV supports predictable power planning and system-level supply design.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C to match standard commercial electronic product environments.
• Compact, Board-Friendly Package: 1152-FBGA (35×35) FCBGA package supports dense board layouts and reliable surface-mount assembly.
• Regulatory Compliance: RoHS compliance supports environmental and regulatory objectives for many product lines.

Why Choose EP2AGZ300FF35C4G?

The EP2AGZ300FF35C4G positions itself as a high-density, I/O-rich FPGA option for commercial electronic products that require substantial on-chip logic and memory. With 298,000 logic elements, approximately 18.85 Mbits of embedded RAM, and 554 I/Os in a compact 1152-FBGA package, it is suited to designs that prioritize integration and board-space efficiency.

Manufactured by Intel and offered as a commercial-grade device, it provides a predictable operating and power profile for teams building complex digital systems that must meet standard commercial environmental ranges and RoHS requirements.

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