EP2AGZ300FF35C3N

The EP2AGZ300FF35C3N is an Arria II GZ field programmable gate array (FPGA) provided in a 1152-BBGA / 1152-FBGA (35 × 35) surface-mount package. It delivers high logic density and substantial on-chip memory alongside a high pin-count I/O complement for commercial-grade designs.

This device targets commercial applications that require large programmable logic capacity, significant embedded memory, and flexible I/O integration while operating within a core voltage range of 870 mV to 930 mV and a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity — 298,000 logic elements (logic cells) to support complex programmable logic implementations and large combinational/sequential designs.
• Embedded Memory — Approximately 18.85 Mbits of on-chip RAM to implement buffers, FIFOs, and local data storage without external memory.
• High I/O Count — 554 user I/O pins for extensive peripheral and bus interfacing options across multiple banks.
• Package and Mounting — 1152-BBGA (FCBGA) supplier package, 1152-FBGA (35×35) footprint; surface-mount mounting for compact PCB integration.
• Power Supply — Core voltage operating range of 870 mV to 930 mV, enabling predictable power domain planning.
• Commercial Grade — Rated for commercial temperature operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

• High-density custom logic — Implement large-scale, application-specific logic functions that require extensive logic elements and embedded RAM.
• I/O consolidation and bridge functions — Aggregate multiple interfaces or protocol bridges using the device’s 554 I/O pins to centralize system connectivity.
• Embedded processing accelerators — Offload compute-intensive tasks to programmable logic using available logic capacity and on-chip memory.
• Compact board-level systems — Integrate advanced programmable capability in space-constrained commercial products with the 1152-FBGA surface-mount package.

Unique Advantages

• High logic density: 298,000 logic elements provide the headroom for complex designs and multi-function implementations.
• Substantial on-chip memory: Approximately 18.85 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O: 554 I/O pins enable broad interface support and flexible partitioning of signals across banks.
• Compact, manufacturable package: 1152-FBGA (35×35) surface-mount package supports high-density PCB layouts and automated assembly processes.
• Commercial temperature rating and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for mainstream commercial product deployments.
• Defined core voltage range: 870 mV to 930 mV core supply simplifies power-supply design and voltage planning.

Why Choose EP2AGZ300FF35C3N?

The EP2AGZ300FF35C3N combines large logic capacity, meaningful embedded memory, and a high I/O count in a compact 1152-FBGA surface-mount package, making it a practical choice for commercial systems that require significant programmable logic and on-chip storage. Its commercial temperature rating and RoHS compliance align it with standard production requirements.

This part is suited to designers and OEMs building complex FPGA-based subsystems where integration density, I/O flexibility, and predictable power/thermal planning are key selection criteria. The device’s specifications support scalable designs that balance logic, memory, and I/O without relying on external components for many core functions.

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