EP2AGZ225HF40I3N

The EP2AGZ225HF40I3N is an Intel Arria II GZ series field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. This industrial-grade device combines high logic capacity, substantial on-chip memory, and a large I/O count to address complex, high-density digital designs.

Key attributes include 224,000 logic elements, approximately 13.6 Mbits of embedded RAM, 734 I/Os, an industrial operating temperature range of −40 °C to 100 °C, and a core supply window of 870 mV to 930 mV, making it suited for demanding embedded and industrial applications where robustness and integration density are required.

Key Features

• Core Logic Capacity — 224,000 logic elements provide the resources required for large-scale custom logic, parallel datapaths, and system-level integration.
• Embedded Memory — Approximately 13.6 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic to minimize external memory dependence.
• High I/O Count — 734 programmable I/O pins to support broad peripheral connectivity, multi-channel interfaces, and high-density board designs.
• Power and Voltage — Core operating supply range from 870 mV to 930 mV to align with system power-rail requirements documented for Arria II devices.
• Industrial Temperature Grade — Rated for −40 °C to 100 °C operation, enabling deployment in elevated-temperature or outdoor industrial environments.
• Package and Mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA package with surface-mount mounting for compact, board-level integration.
• Standards and Compliance — RoHS compliant, supporting environmental and manufacturing requirements for lead-free assembly.
• Manufacturer and Documentation — Part of the Intel Arria II GZ device family with device datasheet and handbook documentation available for electrical and switching characteristics.

Typical Applications

• High-density I/O systems — Leverage 734 I/Os for complex sensor arrays, multisignal acquisition, or multi-protocol interfaces in industrial equipment.
• On-chip buffering and lookup-heavy designs — Approximately 13.6 Mbits of embedded RAM supports local buffering, FIFOs, and LUT-based functions to reduce external memory traffic.
• Large-scale custom logic — 224,000 logic elements enable implementation of wide datapaths, parallel processing engines, and system integration on a single device.

Unique Advantages

• High integration density: Large logic and memory resources reduce the need for multiple devices, simplifying board design and lowering BOM complexity.
• Extensive I/O flexibility: 734 I/Os support diverse peripheral interfacing and consolidation of multiple subsystems onto one FPGA.
• Industrial readiness: −40 °C to 100 °C operating range and surface-mount FCBGA packaging support robust deployments in industrial environments.
• Predictable power envelope: Defined core voltage range (870 mV–930 mV) aids power-supply planning and thermal management during system design.
• Documented device family: Backed by Arria II GZ device handbook and datasheet material for electrical and switching characteristics to guide integration and validation.

Why Choose EP2AGZ225HF40I3N?

The EP2AGZ225HF40I3N positions itself as a high-capacity, industrial-grade FPGA option within the Intel Arria II GZ family. Its combination of 224,000 logic elements, substantial on-chip RAM, and 734 I/Os offers system designers a consolidated platform for implementing complex digital functions with fewer external components.

This device is suited to customers who require scalable logic density, significant embedded memory, and wide I/O capability in temperature-challenging environments. Comprehensive device documentation for the Arria II family supports reliability-focused integration and system-level design decisions.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for EP2AGZ225HF40I3N. Our team can provide the details you need to evaluate this FPGA for your next design.