EP2AGZ225HF40C4N

IC FPGA 734 I/O 1517FBGA
Part Description

Arria II GZ Field Programmable Gate Array (FPGA) IC 734 14248960 224000 1517-BBGA, FCBGA

Quantity 186 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O734Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8960Number of Logic Elements/Cells224000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits14248960

Overview of EP2AGZ225HF40C4N – Arria II GZ Field Programmable Gate Array (FPGA)

The EP2AGZ225HF40C4N is an Arria II GZ Field Programmable Gate Array (FPGA) offered in a 1517-BBGA FCBGA package for surface-mount applications. It provides high logic capacity and on-chip memory with a broad I/O complement to support complex, high-density FPGA designs.

Designed for commercial-grade operation (0 °C to 85 °C) and RoHS-compliant, this device targets system designs that require substantial programmable logic, embedded RAM and a large number of I/O in a compact BGA footprint.

Key Features

  • Logic Capacity  224,000 logic elements suitable for large-scale logic integration and complex designs.
  • Embedded Memory  Approximately 14.25 Mbits of on-chip RAM for buffering, data storage and fast local memory access.
  • I/O Resources  734 general-purpose I/O pins to support wide parallel interfaces and high connectivity requirements.
  • Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), designed for surface-mount assembly.
  • Power  Core supply range 870 mV to 930 mV to support standard low-voltage FPGA operation.
  • Operating Grade & Temperature  Commercial grade with an operating range of 0 °C to 85 °C.
  • Compliance  RoHS compliant for environmental and regulatory alignment.

Unique Advantages

  • High-density programmable logic: 224,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing external component count.
  • Substantial embedded RAM: Approximately 14.25 Mbits of on-chip memory enables efficient data buffering and fast access for performance-sensitive logic.
  • Extensive I/O availability: 734 I/Os allow flexible interfacing to peripherals, sensors, and external buses without immediate need for external expanders.
  • Compact BGA footprint: 1517-FBGA (40×40) package delivers a high pin-count solution in a space-efficient surface-mount form factor.
  • Low-voltage core operation: 870 mV–930 mV core supply supports modern low-voltage system power architectures.
  • Commercial-grade reliability: Specified 0 °C to 85 °C operation and RoHS compliance for mainstream product deployments.

Why Choose EP2AGZ225HF40C4N?

The EP2AGZ225HF40C4N positions itself as a high-capacity, commercially rated Arria II GZ FPGA tailored for designs that require substantial logic resources, abundant embedded memory and a large I/O complement in a compact BGA package. Its combination of 224,000 logic elements, approximately 14.25 Mbits of on-chip RAM and 734 I/Os makes it suitable for consolidating complex functions and reducing system BOM in commercial applications.

Engineers and procurement teams looking for a RoHS-compliant, surface-mount FPGA solution with a 1517-FBGA footprint and defined commercial operating range will find this device a practical option for medium- to high-density programmable logic implementations.

Request a quote or submit a procurement inquiry to receive pricing, availability and lead-time information for the EP2AGZ225HF40C4N.

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