EP2AGZ225FF35I4N

The EP2AGZ225FF35I4N is an Intel Arria II GZ family FPGA supplied in a 1152-FBGA (35×35) FCBGA package and specified for industrial operation. It delivers high logic capacity, substantial on-chip RAM, and a large I/O count for designs that require dense programmable logic and extensive external interfacing.

With a core voltage supply range of 870 mV to 930 mV and an operating temperature span of −40 °C to 100 °C, this device is targeted at industrial-grade embedded systems where robustness, high capacity, and integration density are required.

Key Features

• High Logic Capacity  Provides 224,000 logic elements to implement complex logic, control paths, and custom hardware accelerators.
• Logic Array Blocks  Includes 8,960 logic blocks to structure and partition large designs efficiently.
• Embedded Memory  Approximately 14.25 Mbits of on-chip RAM for data buffering, state storage, and LUT-based memory structures.
• Extensive I/O  A total of 554 user I/Os to support wide parallel interfaces, dense sensor arrays, or multi-channel data links.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Core Power  Core supply voltage specified between 870 mV and 930 mV for integration with targeted power rails.
• Package and Mounting  1152-ball BGA (1152-FBGA, 35×35) FCBGA package; surface-mount mounting type supports high-density PCB designs.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control and Automation  Industrial-grade operating range and large logic/memory resources suit complex control algorithms and real-time processing in factory and process automation.
• High-density Signal Processing  Large logic element count and substantial embedded RAM enable implementation of multi-channel DSP pipelines and custom processing accelerators.
• I/O-Intensive Systems  With 554 I/Os and a compact FCBGA package, the device supports dense external interfacing for sensors, cameras, and parallel data buses.

Unique Advantages

• Significant Programmability  224,000 logic elements allow integration of complex state machines, compute blocks, and system glue logic into a single device.
• Integrated Memory Capacity  Approximately 14.25 Mbits of on-chip RAM reduces reliance on external memory for buffering and intermediate storage.
• High I/O Density  554 I/Os enable flexible pin assignment and support for numerous parallel interfaces without immediate need for external multiplexing.
• Industrial Reliability  Specified −40 °C to 100 °C operating range and industrial grade designation for deployments in demanding environmental conditions.
• Compact, Surface-Mount Package  1152-ball FCBGA package balances integration density with PCB real estate for compact system designs.
• Standards-compliant Manufacturing  RoHS compliance supports environmentally conscious product designs and supply-chain requirements.

Why Choose EP2AGZ225FF35I4N?

The EP2AGZ225FF35I4N Arria II GZ FPGA combines high logic density, substantial embedded memory, and extensive I/O in an industrial-temperature, surface-mount FCBGA package. It is well suited for systems that require integrated, programmable hardware to consolidate functionality, reduce board-level complexity, and meet robust environmental requirements.

Designers and engineers targeting dense digital processing, control systems, or I/O-rich embedded platforms will find the device’s combination of logic resources, memory capacity, and industrial temperature rating valuable for scalable and maintainable designs.

If you would like pricing, availability, or a formal quote for EP2AGZ225FF35I4N, please request a quote or submit an inquiry referencing the part number and required quantities.