EP2AGZ225FF35I3G

The EP2AGZ225FF35I3G is an Intel Field Programmable Gate Array (FPGA) designed for industrial embedded applications that require significant logic capacity and extensive I/O. It combines a high count of logic elements with substantial on-chip memory and a high-density BGA package to enable complex custom logic integration in space-constrained boards.

With a low-voltage core supply range and an industrial operating temperature window, this device is targeted at designers building ruggedized and high-functionality systems that must operate across a wide temperature range.

Key Features

• Core Logic  224,000 logic elements for implementing complex custom logic and control functions.
• Embedded Memory  Approximately 14.2 Mbits of on-chip RAM to support buffers, state machines, and data-path memory.
• High I/O Density  554 I/O pins to accommodate multiple external interfaces and parallel connectivity.
• Power  Core supply voltage range of 870 mV to 930 mV for low-voltage system designs.
• Package & Mounting  Surface-mount 1152-BBGA / FCBGA package; supplier device package specified as 1152-FBGA (35×35) for compact board layouts.
• Thermal & Grade  Industrial grade device rated for operation from -40°C to 100°C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Automation  Implement control logic, motor drives, and deterministic I/O handling where the industrial temperature rating and high I/O count are required.
• High-Density I/O Systems  Serve as the central logic fabric in systems that need many parallel interfaces or multi-channel I/O aggregation.
• Embedded Compute and Custom Logic  Host custom datapaths and protocol engines using the large pool of logic elements and on-chip memory.

Unique Advantages

• High Logic Capacity: 224,000 logic elements enable integration of complex algorithms and multiple functional blocks on a single device.
• Generous On-Chip Memory: Approximately 14.2 Mbits of embedded RAM reduces external memory dependency for many designs.
• Extensive Connectivity: 554 I/O pins provide flexibility for interfacing with sensors, peripherals, and external ICs.
• Industrial Reliability: Rated for -40°C to 100°C operation and classified as Industrial grade for deployments in demanding environments.
• Space-Efficient Packaging: 1152-FBGA (35×35) surface-mount package supports high-density PCB implementations.
• Low-Voltage Core: Core voltage range of 870 mV to 930 mV supports modern low-power power-architecture designs.

Why Choose EP2AGZ225FF35I3G?

The EP2AGZ225FF35I3G provides a balance of high logic capacity, substantial embedded memory, and broad I/O in a compact BGA package, making it well suited for industrial and high-functionality embedded systems. Its industrial temperature rating and RoHS compliance make it a practical choice for designs that require reliable operation across a wide temperature range.

Manufactured by Intel, this FPGA targets designers and procurement teams who need significant on-chip resources and robust packaging for long-term deployments in industrial or space-constrained applications.

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