EP2AGZ225FF35C4G

The EP2AGZ225FF35C4G is an Intel FPGA delivering high logic density and extensive I/O in a compact ball-grid array package. It combines 224,000 logic elements with substantial on-chip memory and a large I/O count to support complex, high-pin-count digital designs.

Designed for commercial applications, this surface-mount device operates from a low-voltage supply of 870 mV to 930 mV and is rated for 0 °C to 85 °C operation. It is RoHS compliant and packaged in a 1152-ball FCBGA/FBGA footprint for space-efficient system integration.

Key Features

• Logic Capacity  224,000 logic elements to implement complex custom logic, state machines, and processing pipelines.
• Embedded Memory  Approximately 14.25 Mbits of total on-chip RAM to support buffering, lookup tables, and data storage for accelerated processing.
• High I/O Count  554 general-purpose I/O pins to support dense external interfacing and multi-channel connectivity.
• Low-Voltage Supply  Operates from 870 mV to 930 mV, enabling integration with low-voltage core power rails.
• Package and Mounting  Available in a 1152-ball BGA (FCBGA) / 1152-FBGA (35×35) package; surface-mount mounting type for PCB-level integration.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant, supporting restricted-substance requirements for assembly.

Typical Applications

• Embedded Systems  Implement custom control logic and peripheral interfaces that require high logic density and significant on-chip memory.
• Communications & Networking  Support protocol processing and parallel I/O handling where a large number of external signals must be managed.
• High-Density I/O Designs  Drive multi-channel data acquisition, aggregation, or fanout applications using the device's 554 I/O pins.
• Prototyping & Development  Validate complex digital architectures and system-level integration with a high logic-element capacity in a single package.

Unique Advantages

• High Logic Integration: 224,000 logic elements enable consolidation of multiple functions into a single device, reducing system-level component count.
• Substantial Embedded Memory: Approximately 14.25 Mbits of on-chip RAM minimizes dependence on external memory for buffering and data processing.
• Extensive I/O Resources: 554 I/O pins provide flexibility for dense peripheral connectivity and high-pin-count interfaces.
• Compact BGA Packaging: 1152-ball FBGA/FCBGA package allows high density on-board placement while preserving signal routing options.
• Low-Voltage Operation: 870 mV–930 mV supply window supports designs targeting low-voltage core rails and optimized power domains.
• RoHS Compliance: Meets restricted-substance standards for environmentally conscious manufacturing and assembly.

Why Choose EP2AGZ225FF35C4G?

The EP2AGZ225FF35C4G is positioned for designs that require significant programmable logic, large embedded memory, and a high number of I/O within a compact BGA package. Its combination of 224,000 logic elements, approximately 14.25 Mbits of on-chip RAM, and 554 I/O pins makes it well suited for complex digital systems and high-pin-count applications.

As a commercial-grade, RoHS-compliant FPGA from Intel, this device offers a balance of integration and practical operating requirements for customers developing advanced embedded and communication-focused designs that benefit from high logic density and extensive interfacing options.

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