EP2AGZ225FF35C3N

The EP2AGZ225FF35C3N is an Arria II GZ field programmable gate array (FPGA) supplied in a 1152-FBGA (35×35) package for surface-mount assembly. It delivers high logic density, extensive embedded memory, and a large number of I/O pins for complex digital designs.

Targeted at commercial-grade applications, this device offers 224,000 logic elements and approximately 14.25 Mbits of on-chip RAM, making it suitable for designs that require substantial programmable logic, embedded memory, and dense connectivity within a compact package.

Key Features

• Logic Capacity  224,000 logic elements to implement complex digital logic and large-scale designs.
• Embedded Memory  Approximately 14.25 Mbits of on-chip RAM to support data buffering, FIFOs, and algorithm state storage.
• High Pin Count I/O  554 user I/O pins for wide external connectivity and parallel interfaces.
• Package & Mounting  1152-FBGA (35×35) package with surface-mount compatibility for compact, high-density board layouts.
• Power Supply  Core supply operating range of 870 mV to 930 mV for defined power-domain integration.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• Standards Compliance  RoHS compliant, supporting regulatory and environmental requirements for lead-free assembly.

Typical Applications

• High-density digital systems  Implement complex state machines, parallel processing blocks, and custom datapaths using the device’s large logic capacity and embedded RAM.
• Data buffering and memory-intensive logic  Use the approximately 14.25 Mbits of on-chip RAM for buffering, packet queues, and temporary storage to reduce external memory requirements.
• Dense I/O interfacing  Leverage 554 I/O pins to connect to multiple peripherals, parallel buses, and external interfaces in compact designs.

Unique Advantages

• Substantial logic resources  224,000 logic elements enable implementation of large, integrated functions without partitioning across multiple devices.
• Significant on-chip RAM  Approximately 14.25 Mbits of embedded memory reduces dependency on external RAM and simplifies board design.
• High I/O density  554 available I/O pins provide flexibility for multi-channel interfaces and parallel data paths.
• Compact, manufacturable package  1152-FBGA (35×35) supports high-density PCB layouts and surface-mount assembly processes.
• Commercial-grade operating range  Specified 0 °C to 85 °C operation aligns with typical commercial application requirements.
• RoHS compliant  Designed for lead-free assembly and regulatory compliance in modern production environments.

Why Choose EP2AGZ225FF35C3N?

The EP2AGZ225FF35C3N combines high logic density, significant embedded RAM, and extensive I/O in a compact 1152-FBGA footprint, providing a balanced platform for complex commercial FPGA designs. Its specified core voltage range and commercial temperature rating make it suitable for production systems that require predictable electrical and thermal behavior.

This device is well suited for design teams seeking a single-chip solution to integrate large programmable logic functions, on-chip memory, and dense peripheral connectivity while maintaining RoHS compliance and surface-mount manufacturability.

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