EP2AGX95EF35I5ES

The EP2AGX95EF35I5ES is an Arria II GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1152‑BBGA (35×35) FCBGA package for surface‑mount applications. It provides a large programmable logic fabric, substantial on‑chip RAM, and a high I/O count for complex digital designs.

Designed and specified for industrial use, this device targets applications that require extensive logic capacity, significant embedded memory, and broad I/O connectivity within a compact BGA package.

Key Features

• Logic Capacity — 89,178 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory — Approximately 6.84 Mbits of on‑chip RAM to support buffering, FIFOs, and memory‑rich algorithms.
• I/O Resources — 452 I/O pins to accommodate wide external interfacing and multi‑lane connectivity requirements.
• Arria II GX Device Family — Includes the programmable I/O element (IOE) and transceiver/PHY blocks as described in the Arria II GX device documentation.
• Power Supply Range — Core supply specified from 870 mV to 930 mV to match system power‑rail designs.
• Industrial Temperature Rating — Operating range of –40 °C to 100 °C for deployment in industrial environments.
• Package & Mounting — 1152‑BBGA (1152‑FBGA) 35×35 FCBGA package, surface mount for reliable PCB assembly and dense board designs.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• Custom Digital Systems — Implement application‑specific logic, control functions, and protocol handling using the device’s large logic array and embedded RAM.
• High‑I/O Control — Systems requiring many external interfaces benefit from the 452 available I/O pins for sensors, peripherals, and multi‑lane connectivity.
• Industrial Automation — Industrial control and instrumentation designs that need an industrial temperature range and robust packaging.
• Memory‑Intensive Functions — Designs requiring on‑chip buffering, packet handling, or temporary data storage can leverage the device’s approximately 6.84 Mbits of embedded RAM.

Unique Advantages

• High logic density: 89,178 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing board-level complexity.
• Substantial on‑chip memory: Approximately 6.84 Mbits of embedded RAM supports data buffering and intermediate storage without external memory.
• Extensive I/O availability: 452 I/O pins enable broad external connectivity and flexible interface options.
• Industrial operating range: Rated from –40 °C to 100 °C for reliable operation in harsh or temperature‑varying environments.
• Compact FCBGA package: 1152‑BBGA (35×35) packaging allows dense PCB layouts while maintaining surface‑mount manufacturability.
• Targeted device family features: Arria II GX architecture includes programmable I/O elements and transceiver resources as documented in the device handbook.

Why Choose EP2AGX95EF35I5ES?

The EP2AGX95EF35I5ES brings a balanced combination of large logic capacity, meaningful on‑chip memory, and a high I/O count in an industrial‑rated FCBGA package. It is well suited for engineering teams looking to integrate multiple digital functions, buffer or process significant data streams on‑chip, and interface with numerous external signals while maintaining a compact PCB footprint.

Backed by Intel’s Arria II GX device documentation and device specifications, this FPGA offers a clear fit for industrial systems, custom digital controllers, and memory‑centric designs where verified device characteristics and robust thermal performance are required.

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