EP2AGX95EF35I3G

The EP2AGX95EF35I3G is an Intel Arria II GX Field Programmable Gate Array (FPGA) supplied in a 1152-ball BGA surface-mount package. As a programmable logic device, it provides on-chip logic resources, embedded memory, and a high I/O count for designs that require configurable digital hardware.

With industrial-grade temperature support and tightly specified supply voltage, this device is intended for use in systems that require reliable programmable logic across a broad operating range.

Key Features

• Logic Capacity — 89,178 logic elements provide substantial programmable logic resource for complex digital designs.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffering, state storage, and memory-intensive functions.
• I/O Density — Up to 452 user I/Os to support extensive peripheral, bus, and interface connections.
• Package & Mounting — 1152-ball BGA (1152-FBGA, 35×35) surface-mount package suitable for compact board-level integration.
• Power Supply — Nominal supply window of 870 mV to 930 mV for core power planning and regulation.
• Operating Temperature — Industrial temperature range from −40 °C to 100 °C for deployment in temperature-variable environments.
• Compliance — RoHS-compliant material status for regulatory and manufacturing considerations.

Typical Applications

• Industrial Control — Programmable logic and I/O capacity make this FPGA suitable for control, sequencing, and custom control logic in industrial systems operating across −40 °C to 100 °C.
• Embedded Systems — Use as a configurable logic fabric for embedded designs that need substantial logic elements and on-chip RAM.
• Prototyping and Custom Hardware — High logic element count and abundant I/Os support board-level prototyping and implementation of custom digital functions.

Unique Advantages

• High Logic Density: 89,178 logic elements enable implementation of complex digital architectures on a single device.
• Significant Embedded Memory: Approximately 6.84 Mbits of RAM reduces reliance on external memory for many buffering and state-storage tasks.
• Extensive I/O: 452 I/Os allow flexible interfacing to multiple peripherals, buses, and external components.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support applications in thermally demanding environments.
• Compact Package: 1152-ball BGA (35×35) surface-mount package facilitates dense PCB integration and compact system layouts.
• Controlled Core Supply Range: 870 mV–930 mV specification assists in precise power delivery and regulator selection.

Why Choose EP2AGX95EF35I3G?

The EP2AGX95EF35I3G delivers a balance of high logic capacity, embedded memory, and substantial I/O in a compact 1152-ball BGA package, making it well suited for designs that require configurable hardware resources within an industrial operating range. Its defined voltage and temperature specifications support robust system integration and predictable power and thermal planning.

This device is appropriate for engineering teams and procurement looking for an FPGA option that combines sizable on-chip resources with industrial-grade temperature capability and RoHS compliance—useful for scalable, durable designs that rely on programmable logic.

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