EP2AGX95EF35I3N

The EP2AGX95EF35I3N is an Intel Arria II GX field-programmable gate array (FPGA) supplied in a 1152-BBGA (35×35) FCBGA package for surface-mount assembly. The device integrates 89,178 logic elements, approximately 6.84 Mbits of embedded RAM, and 452 user I/O pins, providing high logic density, substantial on-chip memory, and large I/O capacity in a single FPGA.

With an industrial operating temperature range of −40°C to 100°C and a core supply window of 870 mV to 930 mV, this device is specified for applications that require robust thermal range and well-defined core voltage operation.

Key Features

• Core Logic Density  89,178 logic elements to implement complex programmable logic and custom processing functions.
• Embedded Memory  Approximately 6.84 Mbits of on-chip RAM for buffering, FIFOs, and embedded data storage.
• High I/O Count  452 available I/O pins to support broad peripheral and bus connectivity without external expander logic.
• Package & Mounting  1152-BBGA (35×35) FCBGA package supplied as surface-mount for dense board-level integration.
• Power Supply Range  Core voltage specified between 870 mV and 930 mV to match regulated core rails and power budgeting.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C for use in thermally demanding environments.
• RoHS Compliant  Device conforms to RoHS requirements.

Typical Applications

• High-density logic and signal processing  Use the 89,178 logic elements and embedded RAM to implement complex algorithms, datapath logic, and buffering inside a single FPGA.
• High I/O interface hubs  Leverage 452 I/O pins to aggregate multiple buses, sensors, or peripheral interfaces without extensive external glue logic.
• Industrial embedded systems  The industrial temperature rating (−40°C to 100°C) and surface-mount FCBGA package support deployment in industrial environments requiring extended temperature performance.

Unique Advantages

• Substantial on-chip resources: Large logic element count combined with approximately 6.84 Mbits of embedded RAM reduces external component count and simplifies board design.
• High I/O integration: 452 I/O pins enable direct connections to dense peripheral arrays and multiple I/O domains.
• Industrial temperature robustness: Specified −40°C to 100°C operation supports use in applications with wide thermal swings.
• Compact FCBGA footprint: 1152-BBGA (35×35) package allows high integration density for space-constrained PCB layouts.
• Defined core voltage window: Core supply range of 870 mV to 930 mV provides a clear target for power-supply design and regulation.

Why Choose EP2AGX95EF35I3N?

The EP2AGX95EF35I3N positions itself as a high-density Arria II GX FPGA option that balances large logic capacity, significant embedded memory, and extensive I/O in a single, industrial-grade FCBGA package. It is suited for engineers and designers who need substantial programmable logic and on-chip RAM while maintaining a controlled power and thermal envelope.

For projects that require scalable programmable logic, high I/O integration, and operation across extended temperatures, this device offers a consolidated platform that reduces external components and simplifies system-level integration.

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