EP2AGZ225FF35I3N

The EP2AGZ225FF35I3N is an Intel Arria II GZ field programmable gate array (FPGA) offered in an industrial-grade configuration. It delivers high logic density and substantial on-chip memory in a ball-grid array package designed for surface-mount assembly.

With 224,000 logic elements and approximately 14.25 Mbits of embedded RAM, this device targets designs that require large programmable logic capacity, significant embedded memory, and up to 554 user I/O pins while operating across an extended temperature range.

Key Features

• Logic Capacity 224,000 logic elements provide substantial programmable logic resources for complex functions and large-scale designs.
• Embedded Memory Approximately 14.25 Mbits of on-chip RAM (total RAM bits: 14,248,960) for data buffering, FIFOs, and memory-intensive logic blocks.
• I/O Density 554 user I/O pins to support broad interfacing requirements and multi-channel connectivity.
• Core Voltage Core supply range of 870 mV to 930 mV, enabling operation within the specified low-voltage core domain.
• Package & Mounting 1152-ball FCBGA package (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for board-level integration.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for extended-temperature environments.
• Regulatory Compliance RoHS compliant, supporting environmental and materials requirements.

Typical Applications

• High-density programmable logic — Use where large counts of logic elements are required to implement complex FPGA designs and custom algorithms.
• Memory-centric designs — Suitable for applications that leverage several megabits of embedded RAM for buffering, packet processing, or data manipulation.
• Multi-I/O systems — Well-suited for designs that require hundreds of I/O signals for interfacing with peripherals, sensors, or multi-lane communication links.
• Industrial electronics — The industrial temperature rating enables deployment in equipment operating across extended ambient conditions.

Unique Advantages

• High logic density: 224,000 logic elements reduce the need for multiple devices by consolidating functionality into a single FPGA.
• Significant on-chip RAM: Approximately 14.25 Mbits of embedded memory simplifies system architecture by keeping data local to the FPGA fabric.
• Large I/O count: 554 I/O pins provide flexibility for complex I/O mapping and integration with multiple subsystems.
• Industrial operating range: −40 °C to 100 °C support for extended-temperature deployments in industrial environments.
• Surface-mount FCBGA package: 1152-ball FCBGA (35×35) offers a compact, high-pin-count solution for board-level designs.
• RoHS compliant: Meets lead-free and restricted-substance requirements for manufacturability and regulatory alignment.

Why Choose EP2AGZ225FF35I3N?

The EP2AGZ225FF35I3N combines substantial programmable logic resources and embedded memory with a high I/O count and industrial temperature capability, making it suitable for designs that require consolidated, high-density FPGA implementations. Its low-voltage core supply and FCBGA surface-mount package enable modern board designs where power and space considerations are important.

This device is well matched to engineering teams building memory-intensive, I/O-rich systems that need a robust FPGA platform with clear, verifiable specifications for logic capacity, embedded RAM, I/O count, operating temperature, and package format.

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