EP2AGZ225HF40C3G

The EP2AGZ225HF40C3G is an Intel-manufactured field programmable gate array (FPGA) supplied in a 1517-FBGA (40×40) surface-mount package. It provides a high-density programmable fabric with 224,000 logic elements and 8,960 logic blocks, combined with substantial embedded memory and a large I/O count for complex system integration.

Designed for commercial-grade applications, this device targets designs that require large programmable logic capacity, abundant I/O and on-chip memory while operating within a 0 °C to 85 °C temperature range and a core supply of 0.87–0.93 V.

Key Features

• Logic Capacity  224,000 logic elements and 8,960 logic blocks provide extensive programmable resources for complex digital functions.
• Embedded Memory  Approximately 14.25 Mbits of on-chip RAM to support buffering, lookup tables and state storage without external memory.
• I/O Density  734 I/O pins enable broad interfacing options for multi-channel signal access and board-level integration.
• Package and Mounting  Supplied in a 1517-FBGA (40×40) FCBGA package with surface-mount mounting for high-density PCB assembly.
• Power  Core voltage supply range of 870 mV to 930 mV to match system power rails and support low-voltage core domains.
• Operating Range and Grade  Commercial grade device specified for 0 °C to 85 °C ambient operation.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing alignment.
• Manufacturer  Intel—device identification and datasheet support available from the manufacturer.

Typical Applications

• High-density digital processing  Use the large logic element count and embedded memory for parallel processing, protocol handling and complex state machines.
• Multi-channel interfacing  734 I/O pins simplify aggregation of multiple sensors, transceivers or peripheral buses on a single FPGA.
• System integration and glue logic  Replace multiple discrete devices by consolidating control, timing and interfacing functions into the FPGA fabric.

Unique Advantages

• Highly integrated programmable fabric: 224,000 logic elements reduce external component count by consolidating complex logic into a single device.
• Substantial on-chip memory: Approximately 14.25 Mbits of embedded RAM supports buffering and local data storage, reducing dependence on external memory.
• Extensive I/O availability: 734 I/O pins offer flexibility for dense connector, sensor and peripheral interfacing without extensive board-level multiplexing.
• Compact FCBGA packaging: 1517-FBGA (40×40) package enables high-density PCB layouts while supporting surface-mount assembly.
• Low-voltage core operation: 0.87–0.93 V supply range supports modern low-voltage system architectures and power optimization strategies.
• RoHS compliant: Aligns with environmental requirements for commercial electronics manufacturing.

Why Choose EP2AGZ225HF40C3G?

The EP2AGZ225HF40C3G delivers a combination of large programmable logic capacity, significant embedded RAM and very high I/O count in a compact FCBGA package, making it well suited for commercial designs that demand dense logic integration and extensive interfacing. Its specified core voltage range and commercial operating temperature rating align with contemporary low-voltage system designs.

Choose this Intel FPGA when you need a single-device solution to consolidate complex digital functions, reduce bill-of-materials and accelerate design iterations while maintaining compliance with RoHS requirements.

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