EP2AGZ225HF40I4G

The EP2AGZ225HF40I4G is an Intel-manufactured FPGA offered in an industrial-grade FCBGA package. It delivers high logic capacity, substantial on-chip memory, and a large I/O count suited to designs that require dense programmable logic and flexible interfacing while operating across an extended temperature range.

Key Features

• Logic Capacity  224,000 logic elements provide a substantial resource pool for complex, custom hardware implementations and parallel processing tasks.
• Embedded Memory  Approximately 14.25 Mbits of on-chip RAM to support buffer, FIFO, and local data-storage requirements without external memory.
• I/O Density  734 I/O pins enable broad connectivity to sensors, peripherals, and high-pin-count interfaces in compact board layouts.
• Power Supply  Core supply range of 870 mV to 930 mV for the FPGA core power domain.
• Package & Mounting  1517-BBGA FCBGA package with supplier device package 1517-FBGA (40×40); surface-mount package suitable for PCB assembly.
• Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Regulatory Compliance  RoHS compliant for lead-free manufacturing processes and environmental compliance.

Typical Applications

• Industrial Control Systems  Industrial-grade temperature rating and high I/O count make this FPGA suitable for programmable logic in automation and control equipment.
• High-Density Interface Boards  Large I/O complement supports complex front-end and back-end interfacing on communication and I/O-concentrator boards.
• Memory-Intensive Logic  Approximately 14.25 Mbits of embedded memory supports local buffering and state storage in custom hardware accelerators and data-path designs.
• Complex FPGA-Based Systems  224,000 logic elements enable multi-function designs that require significant programmable logic resources on a single device.

Unique Advantages

• High Logic Density: 224,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing system complexity and BOM count.
• Substantial On-Chip Memory: Approximately 14.25 Mbits of embedded RAM minimizes reliance on external memory for many buffering and storage needs.
• Extensive I/O Availability: 734 I/Os provide flexibility to interface with numerous peripherals and high-pin-count connectors without external multiplexing.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for deployments in demanding industrial environments.
• Compact Surface-Mount Package: 1517-BBGA/1517-FBGA (40×40) FCBGA packaging supports high-density PCB layouts while enabling automated assembly.
• RoHS Compliant: Supports lead-free manufacturing requirements for environmentally conscious production.

Why Choose EP2AGZ225HF40I4G?

The EP2AGZ225HF40I4G combines a high count of logic elements, sizable embedded memory, and a large I/O complement in an industrial-grade, surface-mount FCBGA package from Intel. These characteristics make it well suited for engineers designing complex, high-density programmable systems that must operate across extended temperature ranges.

Selecting this FPGA supports scalable, consolidated hardware implementations with the benefit of RoHS compliance and manufacturer backing, enabling long-term maintainability and integration into industrial-level designs.

Request a quote or submit a procurement inquiry to get pricing and availability for the EP2AGZ225HF40I4G. Our team can assist with lead time and ordering details.