EP2AGZ300FF35I4N

The EP2AGZ300FF35I4N is an Intel Arria II GZ field programmable gate array (FPGA) IC provided in a 1152-ball BGA/FBGA package. It delivers a large on-chip logic capacity and memory with a high I/O count for complex, board-level programmable logic designs.

Key characteristics available from the device data include 298,000 logic elements, approximately 18.85 Mbits of embedded memory, 554 I/Os, an industrial operating temperature range, and a core supply voltage range of 870 mV to 930 mV.

Key Features

• Programmable Logic Capacity — 298,000 logic elements to implement large or highly parallel logic designs.
• Embedded Memory — Approximately 18.85 Mbits of on-chip RAM for data buffering, state storage, and fast local memory access.
• High I/O Count — 554 I/O pins to support multiple interfaces and dense board-level connectivity.
• Power Supply — Core voltage supply range of 870 mV to 930 mV to match system power-rail designs.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in temperature-demanding environments.
• Package and Mounting — 1152-BBGA (FCBGA) package, supplier device package listed as 1152-FBGA (35×35), suitable for surface-mount assembly.
• Arria II GZ Device Family — Part of the Arria II device family documented in the device handbook, with detailed electrical and switching characteristics provided in the device datasheet.

Unique Advantages

• Large integration density: 298,000 logic elements enable consolidation of complex functions into a single FPGA, reducing external logic.
• Substantial on-chip RAM: Approximately 18.85 Mbits of embedded memory supports buffering and local storage to accelerate data paths.
• Extensive I/O capability: 554 I/Os provide flexibility to connect multiple peripherals, buses, and high-pin-count interfaces without external multiplexing.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in thermally challenging systems.
• Compact surface-mount package: 1152-ball BGA/FBGA (35×35) enables high-density board designs while maintaining manufacturability.
• Intel Arria II GZ family pedigree: Documented electrical and switching specifications from the device handbook aid design validation and system integration.

Why Choose EP2AGZ300FF35I4N?

The EP2AGZ300FF35I4N combines a high logic element count, substantial embedded memory, and a large number of I/Os in a surface-mount FCBGA package, making it well suited for designs that require significant programmable logic capacity and dense board-level connectivity. Its industrial temperature rating and defined core voltage range provide clear parameters for system power and thermal planning.

This device is appropriate for engineers and procurement teams seeking a documented Arria II GZ FPGA option with verifiable device-level specifications for integration into embedded and industrial systems. The available datasheet and device handbook material support electrical characterization and system-level design decisions.

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