EP2AGZ350FF35I4G

The EP2AGZ350FF35I4G is an industrial-grade FPGA IC built on the Arria II device family architecture. It combines a 40‑nm, low‑power programmable logic engine with a high pin‑count package and a broad set of on‑chip resources to address demanding embedded, communications, and industrial control applications.

With 348,500 logic elements, approximately 21.27 Mbits of embedded memory, and 554 user I/Os, this device delivers a balance of logic capacity, memory, and I/O density while operating across a wide industrial temperature range and low core-voltage domain.

Key Features

• Programmable Core 348,500 logic elements based on the Arria II 40‑nm low‑power FPGA engine for flexible logic and control implementations.
• Embedded Memory Approximately 21.27 Mbits of on‑chip RAM to support buffers, FIFOs, and state storage for complex designs.
• I/O Density 554 user I/Os provided in a high‑pin package to support extensive peripheral interfacing and board-level connections.
• Transceiver and Protocol Support (Family) Arria II family features include support for transceivers operating at up to 6.375 Gbps and dedicated circuitry for common serial protocols, enabling high‑speed serial links and system interfaces.
• DSP and Math Capabilities (Family) High‑performance DSP blocks (documented up to 550 MHz in the device family) and configurable multipliers suitable for signal processing and numeric acceleration.
• Package and Mounting Available in a 1152‑ball FBGA/BBGA style package (supplier package listed as 1152‑FBGA (35x35)); surface‑mount construction for standard PCB assembly.
• Power and Voltage Core voltage supply range of 870 mV to 930 mV to match low‑voltage power architectures.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for robust performance in industrial environments.
• Compliance RoHS‑compliant manufacturing for regulatory and environmental compatibility.

Typical Applications

• High‑Speed Communications Use the device where multi‑Gbps serial links and protocol handling are required—leveraging the Arria II family transceiver capabilities and dedicated serial protocol support.
• Network and Telecom Systems Implement packet processing, interface bridging, and protocol offload functions using the device’s large logic capacity and on‑chip memory.
• Industrial Control and Automation Deploy in control logic, sensor aggregation, and deterministic I/O applications that require industrial temperature operation and high I/O counts.
• Signal Processing and DSP Accelerate filtering, FFTs, and other numeric tasks using the device family’s DSP blocks and configurable multipliers.

Unique Advantages

• High Logic Capacity: 348,500 logic elements to implement complex state machines, control logic, and custom compute pipelines on a single device.
• Substantial On‑Chip Memory: Approximately 21.27 Mbits of embedded RAM to reduce external memory dependence and simplify board design for buffering and queueing.
• Extensive I/O Resources: 554 user I/Os support broad peripheral integration and interface flexibility for diverse system requirements.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and packaged for surface‑mount integration, suitable for industrial deployments.
• Low‑Voltage Core: Core supply between 870 mV and 930 mV to align with modern low‑power system rails.
• Compliance and Assembly‑Ready: RoHS‑compliant and available in a high‑ball‑count FCBGA/FBGA package for standard manufacturing flows.

Why Choose EP2AGZ350FF35I4G?

EP2AGZ350FF35I4G offers a balanced combination of logic resources, embedded memory, and I/O density representative of the Arria II family. Its 40‑nm low‑power architecture and family‑level support for high‑speed transceivers and DSP blocks make it well suited to communication, networking, industrial control, and signal processing designs that demand integration and robust thermal performance.

This industrial‑grade FPGA is appropriate for teams seeking a high‑capacity, programmable platform that integrates substantial on‑chip resources while operating across a wide temperature range and low core‑voltage domain, enabling long‑term scalability and dependable system integration.

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