EP2AGZ350FH29C3G

The EP2AGZ350FH29C3G is a Field Programmable Gate Array (FPGA) IC manufactured by Intel. It delivers substantial on-chip logic capacity, embedded memory, and a high I/O count in a compact surface-mount FCBGA package for commercial designs.

With 348,500 logic elements, approximately 21.27 Mbits of embedded RAM, and 281 user I/Os, this device targets commercial embedded systems and complex digital designs that require high integration and dense I/O within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity  Provides 348,500 logic elements to implement large, complex digital functions on-chip.
• Embedded Memory  Approximately 21.27 Mbits of total on-chip RAM for buffer, cache, and data-path storage.
• I/O Integration  281 user I/O pins support dense external connectivity and interface consolidation.
• Package and Mounting  Available in a 780-ball HBGA FCBGA (33×33) package suitable for surface-mount PCB assembly.
• Power Supply  Core voltage range of 870 mV to 930 mV for the device core supply domain.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C and specified as Commercial grade.
• Environmental Compliance  RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

• Commercial Embedded Systems  High logic capacity and on-chip memory make this FPGA suitable for embedded controllers and system-on-module designs in commercial products.
• High-density Digital Processing  Use the large logic element count and embedded RAM for complex data-paths, signal processing blocks, and custom accelerators.
• I/O Aggregation and Interface Bridging  281 I/Os enable integration of multiple peripherals and protocols on a single FPGA device to simplify board-level design.

Unique Advantages

• High Logic Density: 348,500 logic elements reduce the need for multiple devices and simplify partitioning of large designs.
• Substantial On-chip Memory: Approximately 21.27 Mbits of embedded RAM supports memory-intensive functions without relying on external DRAM for many use cases.
• Generous I/O Count: 281 user I/Os allow extensive peripheral and interface connectivity from a single FPGA footprint.
• Compact FCBGA Package: 780-ball HBGA (33×33) package enables a high-density board implementation while remaining compatible with surface-mount assembly.
• Commercial Temperature Range: Rated 0 °C to 85 °C to meet requirements for standard commercial electronics applications.
• RoHS Compliant: Meets environmental compliance expectations for commercial product manufacturing.

Why Choose EP2AGZ350FH29C3G?

The EP2AGZ350FH29C3G balances high logic capacity, significant embedded memory, and a large I/O complement in a compact FCBGA package, making it well suited for commercial designs that need on-chip integration and dense connectivity. Its specified core voltage range and commercial temperature rating provide clear electrical and environmental operating boundaries for system design.

Choose this Intel-manufactured FPGA when your project requires substantial programmable logic, on-chip RAM resources, and extensive I/O in a surface-mount, RoHS-compliant package optimized for commercial applications.

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