EP2AGZ350FH29C4N

The EP2AGZ350FH29C4N is an Intel Arria II GZ FPGA in a 780-ball BGA FCBGA package, provided in a commercial-grade device with surface-mount mounting. It offers a large programmable logic resource of 348,500 logic elements and approximately 21.27 Mbits of on-chip RAM, alongside a high I/O count of 281 pins.

Designed for FPGA-based designs that require significant on-chip memory, dense logic capacity, and high I/O connectivity, this device operates from a core supply range of 0.87 V to 0.93 V and across a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  348,500 logic elements for large, complex programmable-logic implementations and dense design mapping.
• Embedded Memory  Approximately 21.27 Mbits of total on-chip RAM to support memory-intensive functions and buffering within the FPGA fabric.
• I/O Resources  281 general-purpose I/O pins to accommodate multi-channel interfaces and high pin-count board-level connectivity.
• Package & Mounting  780-BBGA (FCBGA) package with supplier device package listed as 780-HBGA (33x33), supplied as a surface-mount component for compact board integration.
• Power  Core voltage supply range of 870 mV to 930 mV to match system power-rail design constraints for Arria II GZ devices.
• Operating Grade & Temperature  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Implement complex state machines, datapaths, and custom accelerators leveraging 348,500 logic elements.
• Memory-intensive FPGA functions  On-chip RAM of approximately 21.27 Mbits supports buffering, packet memory, and embedded data structures within the FPGA fabric.
• I/O-rich interfacing  281 I/Os enable integration with multiple peripherals, sensors, and board-level subsystems requiring numerous IO channels.

Unique Advantages

• Substantial logic density: 348,500 logic elements permit large-scale integration of programmable logic blocks, reducing the need for multiple FPGAs in a design.
• Significant on-chip memory: Approximately 21.27 Mbits of embedded RAM supports data buffering and memory-hungry algorithms without depending solely on external memory.
• High I/O count: 281 I/Os provide flexibility for complex board-level connectivity and multiple parallel interfaces.
• Compact BGA package: 780-ball FCBGA package (supplier: 780-HBGA (33x33)) supports dense board layouts and surface-mount assembly workflows.
• Commercial operating range: Rated 0 °C to 85 °C for systems targeting commercial-temperature deployments.
• Regulatory readiness: RoHS compliance for environmental and manufacturing process alignment.

Why Choose EP2AGZ350FH29C4N?

The EP2AGZ350FH29C4N combines a high logic element count, substantial embedded memory, and a large I/O complement in a compact 780-ball BGA surface-mount package, making it suitable for designs that require dense programmable logic and internal memory resources. Its commercial-grade rating and defined core-voltage range enable consistent electrical integration into board-level power architectures.

This device is well suited to engineering teams and procurement groups seeking an Arria II GZ FPGA offering clear, verifiable specifications for logic, RAM, I/O count, packaging, and operating conditions, providing a transparent basis for system-level design and BOM planning.

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