EP2AGZ350FH29I3N

The EP2AGZ350FH29I3N is an Arria II GZ field programmable gate array (FPGA) available in a 780-BBGA FCBGA package. It provides a high density of programmable logic and embedded memory, making it suitable for system designs that require significant on-chip resources and a high I/O count.

Built and graded for industrial use, this device delivers a combination of large logic capacity, substantial embedded RAM, and an extended operating temperature range, enabling robust deployment in demanding environments.

Key Features

• Logic Capacity — 348,500 logic elements to implement complex digital functions and large-scale programmable designs.
• Logic Array Blocks — 13,940 logic array blocks to structure and organize logic resources efficiently.
• Embedded Memory — Approximately 21.27 Mbits of embedded memory for on-chip storage and buffering.
• I/O Density — 281 programmable I/O pins to support dense interfacing with peripherals and subsystems.
• Package & Mounting — 780-BBGA FCBGA package (supplier package: 780-HBGA 33×33) with surface-mount packaging for board-level integration.
• Power Supply — Core voltage supply range of 870 mV to 930 mV to match system power delivery constraints.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for deployment in extended-temperature environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control Systems — Use the device’s industrial temperature rating and high logic capacity for control algorithms, signal processing, and machine interfacing.
• High-Density Digital Processing — Leverage hundreds of thousands of logic elements and substantial on-chip RAM for complex data-paths, accelerators, and custom processing blocks.
• I/O-Intensive Systems — 281 I/Os enable dense peripheral connectivity for instrumentation, communication interfaces, and board-level aggregation.
• Embedded Memory-Dependent Designs — Approximately 21.27 Mbits of embedded memory supports buffering, LUT-based data storage, and block RAM requirements without external memory.

Unique Advantages

• High Integration Density: 348,500 logic elements reduce the need for multiple discrete ICs by consolidating logic into a single FPGA.
• Substantial On-Chip Memory: Approximately 21.27 Mbits of embedded RAM lowers external memory dependencies and simplifies board design.
• Robust Thermal Range: –40 °C to 100 °C industrial grade operation supports reliable performance in harsh environments.
• Wide I/O Capability: 281 I/Os provide flexibility to interface with numerous peripherals and parallel buses.
• Compact, Surface-Mount Package: 780-BBGA (33×33 supplier package) provides a compact footprint for high-density PCB layouts.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose EP2AGZ350FH29I3N?

The EP2AGZ350FH29I3N positions itself as a high-density, industrial-grade FPGA suited for designers who need extensive programmable logic, significant embedded memory, and a large number of I/Os in a compact surface-mount package. Its operating voltage window and extended temperature rating make it a practical choice for robust, long-lived systems where board real estate and integration density matter.

Choose this device when your project requires scalable logic capacity, on-chip RAM to minimize external components, and reliable operation across an industrial temperature range, all backed by the Arria II GZ device family specifications.

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