EP2AGZ350HF40C3N

The EP2AGZ350HF40C3N is an Arria II GZ field programmable gate array (FPGA) offered in a 1517-BBGA (1517-FBGA, 40×40) package for surface-mount applications. It delivers a high logic capacity and substantial on-chip memory, combined with a large I/O count and a defined commercial operating range.

This device is targeted at designs that require dense programmable logic, significant embedded memory, and high I/O pin count—making it appropriate for complex digital systems where integration of logic, memory, and I/O within a single device is a priority.

Key Features

• High Logic Capacity — 348,500 logic elements for implementing complex state machines, datapaths, and custom logic functions.
• Embedded Memory — Approximately 21.27 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• Dense I/O — 734 user I/O pins to support parallel interfaces, wide buses, and numerous peripheral connections.
• Package and Mounting — 1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor to support compact PCB designs.
• Power Supply Range — Core supply specified between 870 mV and 930 mV, enabling controlled core power budgeting in system design.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for typical commercial-environment deployment.
• Regulatory Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• I/O-Intensive Systems — Use the 734 I/O pins for designs requiring many interface connections or wide parallel data buses.
• Memory-Heavy Processing — Leverage approximately 21.27 Mbits of embedded RAM for local buffering, packet queues, or intermediate storage within datapaths.
• Complex Logic Integration — Implement large custom digital functions and control logic using the 348,500 logic elements.

Unique Advantages

• Large On-Chip Resources: High logic element count and multi-megabit embedded RAM reduce reliance on external devices and simplify board-level architecture.
• High I/O Density: 734 I/O pins provide flexibility to connect numerous peripherals and wide buses without external expanders.
• Compact Surface-Mount Package: 1517-BBGA (40×40) enables high-density PCB layouts while maintaining a robust BGA footprint.
• Commercial Temperature Rating: Rated 0 °C to 85 °C to match standard commercial-product thermal requirements.
• Design Control Over Core Power: Specified core voltage range (870–930 mV) supports predictable power planning in system designs.
• RoHS Compliant: Meets common environmental compliance needs for modern manufacturing.

Why Choose EP2AGZ350HF40C3N?

The EP2AGZ350HF40C3N combines a high count of logic elements and substantial embedded memory with a large I/O complement in a single surface-mount BGA package. That combination makes it well suited for compact systems that require significant on-chip resources and flexible interfacing while adhering to commercial temperature and RoHS requirements.

This device is a strong option for engineers designing complex digital systems who need predictable power characteristics, abundant local memory, and extensive I/O without increasing board-level component count. Its package and specification set support scalable, integration-focused designs.

If you would like pricing, availability, or to request a quote for EP2AGZ350HF40C3N, submit your requirements or RFQ and our team will respond with detailed procurement information.