EP2AGZ350HF40I3G

The EP2AGZ350HF40I3G is a Field Programmable Gate Array (FPGA) IC from Intel. It delivers a high-density programmable logic fabric combined with substantial on-chip memory and a large I/O complement for complex digital designs.

Key device attributes include 348,500 logic elements, approximately 21.27 Mbits of embedded RAM, 734 I/O, industrial grade operation, a surface-mount 1517-FBGA (40×40) package, RoHS compliance, a core supply range of 870 mV to 930 mV, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic 348,500 logic elements provide a high level of programmable logic capacity for complex implementations.
• Embedded Memory Approximately 21.27 Mbits of on-chip RAM for buffering, state storage, and local data operations.
• I/O Capacity 734 I/O pins to support extensive peripheral and signal interfacing.
• Power Core voltage supply range from 870 mV to 930 mV for integration with low-voltage systems.
• Package & Mounting Surface-mount 1517-FBGA (40×40) FCBGA package for compact board-level integration.
• Industrial Operation Rated industrial grade with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance RoHS compliant.

Unique Advantages

• High logic density: 348,500 logic elements enable consolidation of complex functions onto a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 21.27 Mbits of RAM supports large local buffers and state machines without relying solely on external memory.
• Extensive connectivity: 734 I/O pins accommodate dense peripheral interfacing and parallel data paths.
• Industrial-ready thermal range: −40 °C to 100 °C operation supports deployment in temperature-challenged environments.
• Compact FCBGA packaging: The 1517-FBGA (40×40) surface-mount package balances device density with board integration.
• Low-voltage core operation: 0.87–0.93 V supply range facilitates integration with modern low-voltage system rails.

Why Choose EP2AGZ350HF40I3G?

The EP2AGZ350HF40I3G is positioned for designs that require high logic capacity, significant embedded memory, and broad I/O within an industrial-grade, RoHS-compliant FPGA package. Its electrical and thermal specifications allow integration into systems that need compact, resource-rich programmable logic operating across a wide temperature range.

For engineers and procurement teams focused on consolidating functionality while meeting industrial environmental requirements, this Intel FPGA provides on-chip resources and form-factor characteristics suited to demanding applications.

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