EP2AGZ350HF40C4G

The EP2AGZ350HF40C4G is a commercial-grade Field Programmable Gate Array (FPGA) IC from Intel. It provides a high logic density architecture with extensive on-chip memory and a large number of I/O pins, delivered in a 1517-FBGA (40×40) FCBGA package for surface-mount assembly.

Designed for commercial applications that require substantial programmable logic capacity, this device combines approximately 348,500 logic elements, roughly 21 Mbits of embedded memory, and 734 I/O to support complex custom logic and multi-interface designs.

Key Features

• Logic Capacity  Approximately 348,500 logic elements to implement complex custom logic and combinational/sequential functions.
• On-Chip Memory  Approximately 21 Mbits of embedded memory (21,270,528 total RAM bits) to support buffers, FIFOs, and memory-intensive logic.
• I/O Density  734 general-purpose I/O pins, enabling multiple parallel interfaces and high-pin-count connectivity.
• Package  1517-FBGA (40×40) FCBGA package (1517-BBGA) optimized for high-density, surface-mount board designs.
• Power  Operates from a core voltage supply range of 870 mV to 930 mV, allowing designers to align power delivery with system constraints.
• Operating Range  Commercial temperature range rated from 0 °C to 85 °C for standard electronics environments.
• RoHS Compliance  RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Use the device as the programmable logic heart of commercial embedded platforms where high logic density and on-chip memory are required.
• Custom Interface and Glue Logic  Leverage 734 I/O to implement multi-channel interfaces, protocol bridging, and board-level glue logic in complex systems.
• Prototyping and Development  The combination of large logic capacity and substantial embedded RAM supports prototyping of complex algorithms and hardware acceleration concepts.

Unique Advantages

• High Logic Density:  Approximately 348,500 logic elements allow implementation of large-scale programmable designs without external logic expansion.
• Significant On-Chip Memory:  About 21 Mbits of embedded RAM reduce the need for external memory in many buffer and FIFO applications.
• Extensive I/O Count:  734 I/O pins provide flexibility for parallel data paths, multiple interfaces, and complex board-level integrations.
• Commercial Temperature Rating:  Rated 0 °C to 85 °C to match standard commercial electronics deployment scenarios.
• Surface-Mount BGA Package:  1517-FBGA (40×40) packaging supports compact, high-density PCB layouts and reliable solder mounting.
• Regulatory Compatibility:  RoHS-compliant construction aligns with common manufacturing and environmental requirements.

Why Choose EP2AGZ350HF40C4G?

The EP2AGZ350HF40C4G offers a balance of high logic capacity, substantial embedded memory, and a large I/O complement in a commercial-grade FPGA package. Its specifications make it suitable for designers who need to consolidate functions into a single programmable device while maintaining board-level density and flexibility.

Choose this Intel FPGA for commercial designs that demand scalable logic resources, on-chip storage, and extensive connectivity while adhering to common manufacturing and environmental standards.

Request a quote or submit an inquiry today to check availability and pricing for the EP2AGZ350HF40C4G.