EP2AGZ350HF40C3G

The EP2AGZ350HF40C3G is a high-density Field Programmable Gate Array (FPGA) from Intel, designed for complex programmable logic implementations. It provides a large logic fabric, substantial on-chip memory, and a high I/O count to support designs that require dense logic integration and extensive interfacing within commercial temperature ranges.

Key Features

• Logic Capacity — 348,500 logic elements to implement large-scale custom logic, finite-state machines, and datapath processing.
• Embedded Memory — Approximately 21.27 Mbits of on-chip RAM for buffering, lookup tables, and storage of intermediate data.
• I/O Resources — 734 user I/O pins to support extensive peripheral, sensor, and interface connectivity.
• Power — Core voltage supply range of 870 mV to 930 mV for the device core.
• Package and Mounting — 1517-BBGA (FCBGA) 1517-FBGA (40×40) package in a surface-mount form factor suitable for compact PCB layouts.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C.
• Compliance — RoHS-compliant manufacturing.

Typical Applications

• High-density logic designs — Leverage 348,500 logic elements to implement complex custom digital functions and accelerated datapath logic.
• Memory-intensive designs — Use approximately 21.27 Mbits of embedded RAM for FIFOs, buffers, and local storage in streaming and processing applications.
• Multi-interface systems — Support complex connectivity scenarios with 734 I/O pins for parallel peripherals, sensor arrays, or board-level interconnects.

Unique Advantages

• Substantial programmable fabric: 348,500 logic elements provide the capacity to consolidate multiple functions into a single device, reducing system-level component count.
• Significant on-chip memory: Approximately 21.27 Mbits of embedded RAM enables local data storage and reduces external memory bandwidth requirements.
• High I/O density: 734 I/Os simplify board routing for designs that require many external interfaces or parallel connections.
• Compact surface-mount package: 1517-ball FCBGA package supports high-density PCB integration while maintaining a predictable thermal and mechanical profile.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation to meet typical commercial electronics deployment environments.
• RoHS compliant: Manufactured to RoHS standards to support regulatory and environmental requirements.

Why Choose EP2AGZ350HF40C3G?

The EP2AGZ350HF40C3G positions itself as a high-capacity, commercially graded FPGA option for engineers needing large programmable logic resources, abundant embedded memory, and extensive I/O within a compact surface-mount package. Its combination of 348,500 logic elements, approximately 21.27 Mbits of on-chip RAM, and 734 I/O pins makes it suitable for consolidating complex functions on a single IC and simplifying board-level design.

Choose this Intel FPGA when your design requires scalable logic density, significant local memory, and broad interfacing capability with RoHS-compliant manufacturing and standard commercial temperature support.

Request a quote or submit a purchasing inquiry today to learn about availability and delivery for the EP2AGZ350HF40C3G.