EP2AGZ350HF40C4N

The EP2AGZ350HF40C4N is an Intel Arria II GZ field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package, supplied in a 1517-FBGA (40 × 40) footprint. This commercial-grade C4 speed device provides a large fabric and on-chip memory for complex, high-density logic implementations.

With 348,500 logic elements, approximately 21.27 Mbits of embedded memory and 734 I/Os, the device is suited to I/O-dense and memory-intensive designs that require surface-mount, ball-grid packaging and a commercial operating range.

Key Features

• High logic capacity — The device includes 348,500 logic elements to support complex digital designs and parallel processing architectures.
• Embedded memory — Approximately 21.27 Mbits of on-chip RAM provide local buffering and data storage for algorithm acceleration and stateful logic.
• Extensive I/O — 734 general-purpose I/O pins enable high-pin-count connectivity for dense interface and peripheral requirements.
• Power supply — Core voltage operation specified from 870 mV to 930 mV enables predictable core power provisioning and design planning.
• Package and mounting — 1517-BBGA (FCBGA) package case with a supplier device package of 1517-FBGA (40 × 40); surface-mount mounting for PCB integration.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C, suitable for commercial and lab environments.
• Standards compliance — Device is RoHS compliant.

Typical Applications

• I/O-dense interface boards — Use the 734 I/Os to aggregate and protocol-convert between multiple peripherals and subsystems on a single FPGA.
• Memory-heavy data processing — Leverage approximately 21.27 Mbits of embedded RAM for buffering, packet queuing, and intermediate data storage in streaming or packet-based applications.
• Complex digital acceleration — Deploy the 348,500 logic elements to implement wide datapaths, parallel pipelines, and custom accelerators for commercial embedded systems.
• Board-level integration — The 1517-BBGA FCBGA surface-mount package supports compact PCB layouts where ball-grid assembly is required.

Unique Advantages

• Substantial logic density: 348,500 logic elements provide headroom for large state machines, DSP blocks, and custom processing pipelines.
• Significant on-chip RAM: Approximately 21.27 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• High I/O count: 734 I/Os enable multi-protocol interfacing and high channel-count designs without external I/O expanders.
• Commercial-grade reliability: Rated 0 °C to 85 °C for deployment in commercial and lab environments where predictable thermal performance is required.
• Compact BGA packaging: 1517-BBGA (1517-FBGA supplier package) offers a dense, surface-mount solution for space-constrained PCBs.
• Regulatory alignment: RoHS compliance simplifies selection for designs requiring lead-free component policies.

Why Choose EP2AGZ350HF40C4N?

The EP2AGZ350HF40C4N positions itself as a high-capacity Arria II GZ FPGA for commercial designs that demand a mix of large logic resources, substantial embedded memory, and a very high I/O count in a compact FCBGA package. Its specified core voltage range and commercial temperature grade make it straightforward to integrate into standard PCB power and thermal plans.

This part is appropriate for engineering teams building I/O-intensive boards, memory-buffered data paths, or custom hardware accelerators who require a surface-mount ball-grid package and RoHS compliance. The combination of logic density, on-chip RAM, and packaging helps minimize external components and streamline system-level design.

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