EP2AGZ350HF40I4N

The EP2AGZ350HF40I4N is an Intel Arria II GZ field-programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It provides high logic density, substantial embedded RAM, and a large I/O count for designs that require compact, reprogrammable hardware resources.

Documented as part of the Arria II device family, the device’s datasheet and device handbook describe its electrical characteristics, transceiver performance, and I/O timing—information useful for system-level integration and thermal/power planning.

Key Features

• Logic Capacity — 348,500 logic elements provide large programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 21.27 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive algorithms.
• I/O Resources — 734 user I/O pins to accommodate dense interface requirements and multi-protocol connectivity.
• Package & Mounting — 1517-BBGA (FCBGA) package with supplier device package 1517-FBGA (40×40); surface-mount mounting type for high-pin-count board integration.
• Power — Core voltage supply range of 870 mV to 930 mV, enabling targeted power budgeting during system design.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Compliance — RoHS-compliant manufacturing to meet environmental and regulatory requirements.

Typical Applications

• High-density Signal Processing — Use the device’s large logic and embedded memory to implement complex DSP pipelines and data-path acceleration.
• Interface and Bridge Systems — The extensive I/O count supports protocol bridging, multi-channel interfacing, and board-level connectivity.
• Industrial Control and Automation — Industrial-grade temperature range and reprogrammability make it suitable for control, monitoring, and configurable automation tasks.
• Memory-intensive Embedded Algorithms — On-chip RAM supports buffering and state storage for algorithms requiring local, fast-access memory.

Unique Advantages

• High Logic Density: 348,500 logic elements enable implementation of large, feature-rich FPGA designs without sacrificing board space.
• Substantial On-chip Memory: Approximately 21.27 Mbits of embedded RAM reduces external memory dependency and simplifies timing-critical designs.
• Extensive I/O Count: 734 I/Os provide flexibility for complex multi-channel and multi-protocol systems.
• Industrial Operating Range: −40 °C to 100 °C rating supports deployment in demanding industrial environments.
• Compact High-pin-count Package: 1517-BBGA FCBGA (1517-FBGA 40×40) delivers a balance of I/O density and PCB footprint efficiency.
• Low-voltage Core Operation: Core supply between 870 mV and 930 mV aids in precise power management and system-level thermal planning.

Why Choose EP2AGZ350HF40I4N?

The EP2AGZ350HF40I4N positions itself where high logic capacity, significant on-chip memory, and broad I/O capability are required in a single surface-mount FPGA package. Its industrial temperature rating and RoHS compliance make it a fit for reliable deployment in industrial systems that demand reprogrammable hardware resources.

Designers seeking a documented device from the Arria II family will find datasheet and device handbook coverage for electrical characteristics, I/O timing, and transceiver performance to support system-level validation and integration.

If you need availability, pricing, or a formal quote for the EP2AGZ350HF40I4N, request a quote or submit an inquiry and our team will provide the details you need to move your design forward.