EP2C15AF256C6NES

IC FPGA 152 I/O 256FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 152 239616 14448 256-LBGA

Quantity 725 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O152Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs903Number of Logic Elements/Cells14448
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP2C15AF256C6NES – Cyclone® II FPGA, 256‑LBGA, 14,448 logic elements

The EP2C15AF256C6NES is a Cyclone® II field programmable gate array (FPGA) optimized for commercial applications that require mid‑range logic capacity and on‑chip memory. It integrates 14,448 logic elements, approximately 0.24 Mbits of embedded RAM, and 152 I/O pins in a compact 256‑ball BGA package.

With a nominal core supply range of 1.15 V to 1.25 V and an operating temperature range of 0 °C to 85 °C, this device is suited to commercial electronic designs that demand balanced logic density, I/O count, and power requirements.

Key Features

  • Core Logic 14,448 logic elements provide mid‑range programmable logic capacity for custom digital functions.
  • Embedded Memory Approximately 0.24 Mbits of on‑chip RAM for buffering, FIFOs, and small data storage needs.
  • I/O Count 152 I/O pins to support multiple parallel interfaces and external device connections.
  • Package 256‑ball BGA (package case: 256‑LBGA; supplier device package: 256‑FBGA, 17×17) for a compact board footprint and reliable soldered mounting.
  • Power Core voltage supply range of 1.15 V to 1.25 V to match supported power delivery designs.
  • Operating Range Commercial grade: 0 °C to 85 °C operating temperature, suitable for standard commercial environments.
  • RoHS Compliant Device is RoHS compliant to support lead‑free manufacturing processes.

Unique Advantages

  • Balanced logic density: 14,448 logic elements deliver substantial programmable resources without the footprint of larger devices, simplifying board layout.
  • Integrated on‑chip RAM: Approximately 0.24 Mbits of embedded memory reduces external memory requirements for many control and buffering tasks.
  • High I/O count in a compact package: 152 I/Os in a 256‑ball BGA provide broad connectivity while preserving PCB area.
  • Commercial temperature range: Rated 0 °C to 85 °C for reliable operation in standard commercial applications.
  • Low core voltage: 1.15 V–1.25 V core supply helps constrain power consumption in system designs.
  • RoHS compliance: Supports lead‑free assembly processes and modern manufacturing requirements.

Why Choose EP2C15AF256C6NES?

The EP2C15AF256C6NES positions itself as a practical mid‑range Cyclone® II FPGA option for commercial designs that need a combination of logic capacity, embedded memory, and a generous I/O complement in a compact BGA package. Its specifications make it suitable for designs where on‑chip RAM and a moderate number of I/Os can simplify system architecture and reduce board‑level components.

Engineers seeking a commercial‑grade FPGA with clear power and temperature specifications, RoHS compliance, and a compact 256‑ball package will find this device aligns with procurement and integration requirements for a wide range of standard electronic products.

Request a quote or submit a procurement inquiry to begin sourcing EP2C15AF256C6NES for your next commercial FPGA design project.

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