EP2C15AF256C7N

The EP2C15AF256C7N is an Intel Cyclone® II family FPGA delivering a balanced combination of logic capacity, embedded memory, and programmable I/O for commercial designs. Built for low-cost embedded processing and DSP-oriented applications, this device provides a compact, surface-mount solution for designers needing flexible, reconfigurable logic in a 256-ball BGA footprint.

This FPGA offers 14,448 logic elements, approximately 0.24 Mbits of embedded RAM, and 152 programmable I/O pins, making it suitable for a range of I/O‑centric control, interface and signal-processing tasks within a commercial temperature range.

Key Features

• Logic Capacity  14,448 logic elements (cells) to implement custom digital logic, state machines, and control functions.
• Embedded Memory  Approximately 0.24 Mbits of on-chip RAM (239,616 total RAM bits) for FIFOs, buffers, and local data storage.
• I/O Resources  152 programmable I/O pins to support diverse peripheral interfacing and multi‑bank signal routing.
• Low-Voltage Core Supply  Core voltage range from 1.15 V to 1.25 V to match system power-rail requirements and enable low-voltage operation.
• Package & Mounting  256-LBGA package; supplier device package listed as 256-FBGA (17×17). Surface-mount mounting for compact PCB integration.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial-grade embedded products.
• Standards & Compliance  RoHS compliant to meet regulatory requirements for lead‑free assemblies.
• Cyclone II Architecture  Part of the Cyclone II family—documentation for the family details architecture elements such as global clock networks, PLLs, embedded multipliers, and flexible I/O structure.

Typical Applications

• Low-cost embedded processing  Implements custom processing blocks and glue logic for cost-sensitive embedded systems.
• Low-cost DSP solutions  Suitable for signal-processing tasks that require on-chip logic and embedded memory for intermediate data storage.
• I/O‑intensive control and interfacing  152 I/O pins enable complex peripheral interfaces, protocol bridging, and real-time control inputs/outputs.

Unique Advantages

• Ample logic resources: 14,448 logic elements provide capacity for moderate-complexity designs without external CPLDs or additional FPGAs.
• On-chip memory for buffering: Approximately 0.24 Mbits of RAM reduces dependence on external memory for many control and buffering tasks.
• Extensive I/O count: 152 I/O pins give designers flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Compact BGA packaging: 256-ball BGA (256-FBGA, 17×17) enables dense PCB layouts while maintaining surface-mount assembly compatibility.
• Commercial temperature rating: Rated 0 °C to 85 °C for deployment in general-purpose commercial applications and products.
• RoHS compliant: Meets lead‑free assembly requirements for modern electronics manufacturing.

Why Choose EP2C15AF256C7N?

The EP2C15AF256C7N positions itself as a versatile, commercially rated FPGA from the Cyclone II family that balances logic density, embedded memory, and a high I/O count within a compact surface-mount BGA package. It is well suited for designers targeting low-cost embedded processing, DSP tasks, and I/O-heavy control or interface functions where a reconfigurable hardware engine is required.

With Intel documentation and Cyclone II family architecture resources available, this device provides a clear upgrade path and an established ecosystem for designers focused on scalability, integration, and reliable commercial deployment.

If you would like pricing, availability, or to request a quote for the EP2C15AF256C7N, submit a procurement inquiry or request a quote from your preferred distributor or procurement channel.