EP2C15AF256I8N
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 152 239616 14448 256-LBGA |
|---|---|
| Quantity | 722 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 152 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 903 | Number of Logic Elements/Cells | 14448 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 239616 |
Overview of EP2C15AF256I8N – Cyclone® II Field Programmable Gate Array (FPGA), 152 I/Os, ~0.24 Mbits RAM, 14,448 logic elements, 256-LBGA
The EP2C15AF256I8N is a Cyclone® II family FPGA manufactured by Intel designed for cost-sensitive embedded and DSP applications. It implements the Cyclone II architecture with a balance of logic capacity, on-chip memory, and I/O to address board-level programmability and protocol interfacing needs.
With 14,448 logic elements, approximately 0.24 Mbits of embedded memory, and 152 I/Os in a 256-ball BGA package, this device targets industrial applications that require flexible connectivity, deterministic clocking, and support across a wide operating temperature range.
Key Features
- Logic Capacity 14,448 logic elements provide programmable resources for implementing glue logic, control state machines, and moderate-complexity custom logic blocks.
- Embedded Memory Approximately 0.24 Mbits (239,616 bits) of on-chip RAM for FIFOs, buffering, and small data storage without external memory.
- I/O Density & Flexibility 152 user I/Os support a variety of interfaces; the Cyclone II architecture includes support for advanced I/O standards and high-speed differential interfaces.
- Clocking and DSP Support Architecture includes a global clock network, PLL support, and embedded multipliers to assist DSP and timing-critical designs (as described in the Cyclone II Device Handbook).
- Power Core supply range of 1.15 V to 1.25 V to match system power rails and support low-voltage designs.
- Package & Mounting 256-ball BGA package (listed as 256-LBGA; supplier package noted as 256-FBGA, 17×17), surface-mount mounting ideal for compact PCB layouts.
- Industrial Grade & Temperature Industrial-grade device with an operating temperature range of −40 °C to 100 °C for demanding environments.
- Regulatory RoHS compliant.
Typical Applications
- Low-Cost Embedded Processing Implement control logic, protocol bridges, and custom peripherals where a balance of logic and on-chip memory reduces BOM and board complexity.
- Digital Signal Processing Use embedded multipliers and the Cyclone II clocking resources for moderate DSP tasks and data-path acceleration in cost-sensitive systems.
- Industrial Control & Automation Leverage the industrial temperature rating and flexible I/O count to interface with sensors, actuators, and fieldbus peripherals.
- Memory and Interface Bridging Implement external memory interfaces, protocol conversion, and timing-critical glue logic between system components.
Unique Advantages
- High integration in a compact package: 14,448 logic elements and embedded RAM reduce the need for external glue logic and memory, simplifying board design.
- Flexible connectivity: 152 I/Os and architecture-level support for advanced I/O standards provide options for diverse peripheral and memory interfaces.
- Deterministic clocking and DSP-friendly resources: Global clock network, PLLs, and embedded multipliers enable robust timing and moderate signal processing tasks.
- Industrial robustness: Rated for −40 °C to 100 °C operation and RoHS compliant for industrial deployments.
- Low-voltage core operation: 1.15 V to 1.25 V supply range supports modern low-voltage systems and helps optimize power budgets.
- Well-documented family: Supported by the Cyclone II Device Handbook and associated documentation for architectural and implementation guidance.
Why Choose EP2C15AF256I8N?
The EP2C15AF256I8N positions itself as a practical Cyclone II FPGA option for designers who need moderate logic density, embedded memory, and flexible I/O in an industrial-temperature device. Its combination of 14,448 logic elements, approximately 0.24 Mbits of on-chip RAM, and dedicated clocking/DSP resources make it suitable for embedded control, DSP offload, and interface consolidation on space-constrained PCBs.
Designed for longevity in production systems, the device benefits from Intel’s Cyclone II family documentation and established development guidance, making it a compelling choice for embedded system engineers and industrial OEMs seeking a field-programmable, RoHS-compliant solution with broad application flexibility.
Request a quote or submit an inquiry to receive pricing and availability for the EP2C15AF256I8N and to discuss how it can fit into your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018