EP2C15AF256I8N

IC FPGA 152 I/O 256FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 152 239616 14448 256-LBGA

Quantity 722 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O152Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs903Number of Logic Elements/Cells14448
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP2C15AF256I8N – Cyclone® II Field Programmable Gate Array (FPGA), 152 I/Os, ~0.24 Mbits RAM, 14,448 logic elements, 256-LBGA

The EP2C15AF256I8N is a Cyclone® II family FPGA manufactured by Intel designed for cost-sensitive embedded and DSP applications. It implements the Cyclone II architecture with a balance of logic capacity, on-chip memory, and I/O to address board-level programmability and protocol interfacing needs.

With 14,448 logic elements, approximately 0.24 Mbits of embedded memory, and 152 I/Os in a 256-ball BGA package, this device targets industrial applications that require flexible connectivity, deterministic clocking, and support across a wide operating temperature range.

Key Features

  • Logic Capacity  14,448 logic elements provide programmable resources for implementing glue logic, control state machines, and moderate-complexity custom logic blocks.
  • Embedded Memory  Approximately 0.24 Mbits (239,616 bits) of on-chip RAM for FIFOs, buffering, and small data storage without external memory.
  • I/O Density & Flexibility  152 user I/Os support a variety of interfaces; the Cyclone II architecture includes support for advanced I/O standards and high-speed differential interfaces.
  • Clocking and DSP Support  Architecture includes a global clock network, PLL support, and embedded multipliers to assist DSP and timing-critical designs (as described in the Cyclone II Device Handbook).
  • Power  Core supply range of 1.15 V to 1.25 V to match system power rails and support low-voltage designs.
  • Package & Mounting  256-ball BGA package (listed as 256-LBGA; supplier package noted as 256-FBGA, 17×17), surface-mount mounting ideal for compact PCB layouts.
  • Industrial Grade & Temperature  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for demanding environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • Low-Cost Embedded Processing  Implement control logic, protocol bridges, and custom peripherals where a balance of logic and on-chip memory reduces BOM and board complexity.
  • Digital Signal Processing  Use embedded multipliers and the Cyclone II clocking resources for moderate DSP tasks and data-path acceleration in cost-sensitive systems.
  • Industrial Control & Automation  Leverage the industrial temperature rating and flexible I/O count to interface with sensors, actuators, and fieldbus peripherals.
  • Memory and Interface Bridging  Implement external memory interfaces, protocol conversion, and timing-critical glue logic between system components.

Unique Advantages

  • High integration in a compact package: 14,448 logic elements and embedded RAM reduce the need for external glue logic and memory, simplifying board design.
  • Flexible connectivity: 152 I/Os and architecture-level support for advanced I/O standards provide options for diverse peripheral and memory interfaces.
  • Deterministic clocking and DSP-friendly resources: Global clock network, PLLs, and embedded multipliers enable robust timing and moderate signal processing tasks.
  • Industrial robustness: Rated for −40 °C to 100 °C operation and RoHS compliant for industrial deployments.
  • Low-voltage core operation: 1.15 V to 1.25 V supply range supports modern low-voltage systems and helps optimize power budgets.
  • Well-documented family: Supported by the Cyclone II Device Handbook and associated documentation for architectural and implementation guidance.

Why Choose EP2C15AF256I8N?

The EP2C15AF256I8N positions itself as a practical Cyclone II FPGA option for designers who need moderate logic density, embedded memory, and flexible I/O in an industrial-temperature device. Its combination of 14,448 logic elements, approximately 0.24 Mbits of on-chip RAM, and dedicated clocking/DSP resources make it suitable for embedded control, DSP offload, and interface consolidation on space-constrained PCBs.

Designed for longevity in production systems, the device benefits from Intel’s Cyclone II family documentation and established development guidance, making it a compelling choice for embedded system engineers and industrial OEMs seeking a field-programmable, RoHS-compliant solution with broad application flexibility.

Request a quote or submit an inquiry to receive pricing and availability for the EP2C15AF256I8N and to discuss how it can fit into your next design.

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