EP2C15AF256C6N

IC FPGA 152 I/O 256FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 152 239616 14448 256-LBGA

Quantity 364 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O152Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs903Number of Logic Elements/Cells14448
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP2C15AF256C6N – Cyclone® II Field Programmable Gate Array (FPGA) IC 152 239616 14448 256-LBGA

The EP2C15AF256C6N is a Cyclone II family FPGA offering a balanced mix of logic density, embedded memory and I/O for cost-sensitive embedded and DSP-oriented designs. Built on the Cyclone II architecture, the device provides 14,448 logic elements and approximately 0.24 Mbits of on-chip RAM to implement mid-range programmable logic functions.

Designed for commercial applications, the device supports a 1.15 V to 1.25 V core supply, 152 user I/O pins and is supplied in a 256-ball LBGA package (supplier device package: 256-FBGA, 17×17). The Cyclone II family includes architecture features such as phase-locked loops (PLLs), embedded multipliers and dedicated clock networks to simplify timing and signal-handling tasks.

Key Features

  • Core Architecture  Cyclone II family architecture with dedicated global clock network and support for phase-locked loops (PLLs) to manage clocking and timing across designs.
  • Logic Capacity  14,448 logic elements suitable for implementing a range of embedded control, glue-logic and mid-density signal-processing functions.
  • Embedded Memory  Approximately 0.24 Mbits of on-chip RAM for buffering, small FIFOs and local data storage.
  • DSP Resources  Family-level support for embedded multipliers to accelerate numeric and DSP-oriented operations.
  • I/O and Interface Options  152 I/O pins with advanced I/O capabilities noted in the Cyclone II handbook, including high-speed differential interfaces and on-chip termination options.
  • Power and Voltage  Core supply range from 1.15 V to 1.25 V to match system power domains and optimize power delivery.
  • Package and Mounting  Surface-mount 256-LBGA package (supplier device package: 256-FBGA, 17×17) for compact board integration.
  • Operating Range & Compliance  Commercial grade operation from 0 °C to 85 °C and RoHS-compliant for environmental regulatory needs.

Typical Applications

  • Low-Cost Embedded Processing  Implement control logic, protocol bridges or glue functions where a mid-density FPGA and on-chip memory reduce BOM and board complexity.
  • DSP and Numeric Acceleration  Use embedded multipliers and on-chip RAM to accelerate filtering, fixed-point math and small signal-processing tasks.
  • Peripheral and Interface Bridging  Leverage 152 I/O pins and advanced I/O capabilities for interfacing sensors, memory devices and communication peripherals.
  • Clocking-Dependent Designs  Designs that require flexible clocking or multiple clock domains can benefit from the Cyclone II global clock network and PLL support.

Unique Advantages

  • Balanced Integration: 14,448 logic elements combined with ~0.24 Mbits of embedded memory provide a mid-range resource set that reduces the need for external glue logic.
  • Flexible I/O Count: 152 user I/O pins in a compact 256-ball LBGA package enable multiple peripheral interfaces without large board area.
  • Clock and DSP Support: Family-level PLLs and embedded multipliers simplify implementation of timing-critical and DSP functions, shortening development cycles.
  • Compact Packaging: 256-FBGA (17×17) supplier package supports dense PCB layouts while maintaining necessary I/O and thermal characteristics for commercial designs.
  • Commercial Temperature & RoHS: Rated for 0 °C to 85 °C operation and RoHS-compliant to meet common commercial deployment requirements.

Why Choose EP2C15AF256C6N?

The EP2C15AF256C6N positions itself as a practical Cyclone II FPGA choice for designers seeking a cost-conscious, mid-density programmable device with integrated memory, DSP resources and robust clocking features. Its combination of 14,448 logic elements, approximately 0.24 Mbits of embedded RAM, 152 I/O and family-level capabilities such as PLLs and embedded multipliers makes it suitable for embedded control, interface bridging and modest signal-processing tasks.

Supported by Cyclone II family documentation and delivered in a compact 256-LBGA (256-FBGA, 17×17) package, this commercial-grade, RoHS-compliant device offers a scalable option for development teams balancing integration, board space and predictable operating conditions.

Request a quote or submit a quote request to obtain pricing and availability for the EP2C15AF256C6N for your next design. Our team will respond with configuration and lead-time details tailored to your project needs.

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