EP2C15AF256C6N
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 152 239616 14448 256-LBGA |
|---|---|
| Quantity | 364 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 152 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 903 | Number of Logic Elements/Cells | 14448 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 239616 |
Overview of EP2C15AF256C6N – Cyclone® II Field Programmable Gate Array (FPGA) IC 152 239616 14448 256-LBGA
The EP2C15AF256C6N is a Cyclone II family FPGA offering a balanced mix of logic density, embedded memory and I/O for cost-sensitive embedded and DSP-oriented designs. Built on the Cyclone II architecture, the device provides 14,448 logic elements and approximately 0.24 Mbits of on-chip RAM to implement mid-range programmable logic functions.
Designed for commercial applications, the device supports a 1.15 V to 1.25 V core supply, 152 user I/O pins and is supplied in a 256-ball LBGA package (supplier device package: 256-FBGA, 17×17). The Cyclone II family includes architecture features such as phase-locked loops (PLLs), embedded multipliers and dedicated clock networks to simplify timing and signal-handling tasks.
Key Features
- Core Architecture Cyclone II family architecture with dedicated global clock network and support for phase-locked loops (PLLs) to manage clocking and timing across designs.
- Logic Capacity 14,448 logic elements suitable for implementing a range of embedded control, glue-logic and mid-density signal-processing functions.
- Embedded Memory Approximately 0.24 Mbits of on-chip RAM for buffering, small FIFOs and local data storage.
- DSP Resources Family-level support for embedded multipliers to accelerate numeric and DSP-oriented operations.
- I/O and Interface Options 152 I/O pins with advanced I/O capabilities noted in the Cyclone II handbook, including high-speed differential interfaces and on-chip termination options.
- Power and Voltage Core supply range from 1.15 V to 1.25 V to match system power domains and optimize power delivery.
- Package and Mounting Surface-mount 256-LBGA package (supplier device package: 256-FBGA, 17×17) for compact board integration.
- Operating Range & Compliance Commercial grade operation from 0 °C to 85 °C and RoHS-compliant for environmental regulatory needs.
Typical Applications
- Low-Cost Embedded Processing Implement control logic, protocol bridges or glue functions where a mid-density FPGA and on-chip memory reduce BOM and board complexity.
- DSP and Numeric Acceleration Use embedded multipliers and on-chip RAM to accelerate filtering, fixed-point math and small signal-processing tasks.
- Peripheral and Interface Bridging Leverage 152 I/O pins and advanced I/O capabilities for interfacing sensors, memory devices and communication peripherals.
- Clocking-Dependent Designs Designs that require flexible clocking or multiple clock domains can benefit from the Cyclone II global clock network and PLL support.
Unique Advantages
- Balanced Integration: 14,448 logic elements combined with ~0.24 Mbits of embedded memory provide a mid-range resource set that reduces the need for external glue logic.
- Flexible I/O Count: 152 user I/O pins in a compact 256-ball LBGA package enable multiple peripheral interfaces without large board area.
- Clock and DSP Support: Family-level PLLs and embedded multipliers simplify implementation of timing-critical and DSP functions, shortening development cycles.
- Compact Packaging: 256-FBGA (17×17) supplier package supports dense PCB layouts while maintaining necessary I/O and thermal characteristics for commercial designs.
- Commercial Temperature & RoHS: Rated for 0 °C to 85 °C operation and RoHS-compliant to meet common commercial deployment requirements.
Why Choose EP2C15AF256C6N?
The EP2C15AF256C6N positions itself as a practical Cyclone II FPGA choice for designers seeking a cost-conscious, mid-density programmable device with integrated memory, DSP resources and robust clocking features. Its combination of 14,448 logic elements, approximately 0.24 Mbits of embedded RAM, 152 I/O and family-level capabilities such as PLLs and embedded multipliers makes it suitable for embedded control, interface bridging and modest signal-processing tasks.
Supported by Cyclone II family documentation and delivered in a compact 256-LBGA (256-FBGA, 17×17) package, this commercial-grade, RoHS-compliant device offers a scalable option for development teams balancing integration, board space and predictable operating conditions.
Request a quote or submit a quote request to obtain pricing and availability for the EP2C15AF256C6N for your next design. Our team will respond with configuration and lead-time details tailored to your project needs.

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