EP2AGZ350HF40I3N

The EP2AGZ350HF40I3N is an industrial-grade Arria II GZ field programmable gate array (FPGA) supplied in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. It combines a large logic fabric with substantial embedded memory and a high I/O count for complex, high-density programmable logic designs.

Designed for embedded and system-level applications that require flexible logic, abundant on-chip memory, and broad I/O connectivity, this device delivers a balance of integration and deterministic electrical characteristics for industrial environments.

Key Features

• Logic Capacity — 348,500 logic elements for implementing large combinational and sequential logic structures.
• Embedded Memory — Approximately 21.27 Mbits of on-chip RAM (21,270,528 bits) to support data buffering, FIFOs, and memory-intensive logic functions.
• I/O Resources — 734 user I/Os to support wide parallel interfaces, multiple banks, and dense connectivity to external devices.
• Package and Mounting — 1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board designs.
• Power Supply Range — Core supply specified between 870 mV and 930 mV to align with system power-rail design requirements.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for reliable performance across industrial temperature ranges.
• Standards Compliance — RoHS compliant, meeting common environmental and material requirements.
• Documentation — Supported by the Arria II Device Handbook device datasheet, which details electrical and switching characteristics including transceiver specifications, core and periphery performance, and I/O timing.

Typical Applications

• Industrial Control — Implement deterministic control logic, real-time interfaces, and protocol bridging in factory automation and motor control systems.
• Data Acquisition & Processing — Use embedded memory and extensive logic to buffer, pre-process, and route sensor or instrument data streams.
• Telecommunications Infrastructure — Provide flexible protocol handling, parallel I/O aggregation, and timing logic for network equipment.
• Instrumentation & Test — Deploy custom measurement, timing, and signal-conditioning logic with large I/O counts and on-chip memory for capture and analysis.

Unique Advantages

• High Logic Density: 348,500 logic elements enable large, complex designs without immediate migration to larger device families.
• Substantial On-Chip Memory: Approximately 21.27 Mbits of embedded RAM reduces dependency on external memory for many buffering and processing tasks.
• Extensive I/O Count: 734 I/Os provide flexibility to interface to multiple peripherals, sensors, and high-pin-count connectors directly.
• Industrial Reliability: Operation from −40 °C to 100 °C supports deployment in harsh or wide-temperature environments.
• Compact, Surface-Mount Package: 1517-BBGA (40×40) packaging enables high-density PCB layouts while maintaining robust mechanical and thermal characteristics.
• Datasheet-Level Electrical Detail: Backed by comprehensive Arria II device documentation that includes electrical and switching characteristics for system-level design confidence.

Why Choose EP2AGZ350HF40I3N?

The EP2AGZ350HF40I3N positions itself as a high-capacity, industrial-grade FPGA option within the Arria II GZ family, combining hundreds of thousands of logic elements, multi-megabit embedded memory, and hundreds of I/Os in a compact BGA package. It is suited for engineers designing embedded systems, industrial controllers, and data-processing hardware that require significant on-chip resources and robust temperature performance.

Supported by detailed device documentation, this part offers designers clear electrical and timing characteristics to aid integration and verification, helping teams scale and iterate designs with predictable behavior.

Request a quote or submit a sales inquiry to receive pricing, availability, and additional technical information for EP2AGZ350HF40I3N.