EP2AGZ350HF40I3

The EP2AGZ350HF40I3 is an Intel Arria II GZ field programmable gate array (FPGA) provided in a 1517-BBGA FCBGA package. It delivers high logic capacity and substantial on-chip memory in a surface-mount, industrial-grade device suitable for designs that require dense programmable logic and broad I/O counts.

With 348,500 logic elements, approximately 21.3 Mbits of embedded memory and 734 I/O pins, this FPGA targets applications that benefit from high integration, flexible interfacing and extended operating temperature ranges.

Key Features

• High-density logic  348,500 logic elements provide substantial programmable fabric for complex digital designs and custom accelerators.
• Embedded memory  Approximately 21.3 Mbits of on-chip RAM to support buffering, look-up tables and intermediate data storage without external memory.
• Extensive I/O  734 I/O pins enable broad peripheral connectivity and multiple interface implementations within a single device.
• Power  Core voltage supply range of 870 mV to 930 mV for the device voltage domain.
• Package & mounting  1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board-level integration.
• Temperature range & grade  Industrial-grade device specified for operation from −40 °C to 100 °C.
• Environmental compliance  RoHS compliant.

Typical Applications

• Industrial automation  Leverage the device’s industrial operating range, high logic density and large I/O count for motor control, sensor aggregation and deterministic control systems.
• Communications infrastructure  Use the FPGA’s logic capacity and embedded memory for packet processing, protocol handling and interface bridging in networking equipment.
• Signal processing and data acquisition  Implement custom signal pipelines, buffering and preprocessing tasks using the on-chip RAM and abundant logic resources.

Unique Advantages

• Highly integrated solution: High logic element count and significant on-chip RAM reduce the need for external components and simplify system architecture.
• Broad connectivity options: 734 I/Os allow flexible partitioning of interfaces across a range of peripherals and high-pin-count protocols.
• Industrial robustness: Specified for −40 °C to 100 °C operation and listed as industrial grade for deployment in demanding environments.
• Compact board-level implementation: Surface-mount 1517-BBGA (1517-FBGA, 40×40) package supports dense PCB layouts while maintaining high pin count.
• Controlled power domain: Defined core voltage supply range (870 mV to 930 mV) for precise power planning and integration.
• Regulatory compliance: RoHS compliance supports environmentally conscious design requirements.

Why Choose EP2AGZ350HF40I3?

The EP2AGZ350HF40I3 combines substantial logic capacity, ample embedded memory and a high I/O count in an industrial-grade, surface-mount FPGA. It is well suited to designs that require dense programmable logic, significant on-chip buffering and reliable operation across extended temperature ranges.

Manufactured by Intel and delivered in a compact 1517-BBGA package, this device addresses integration and scalability needs for system designers building industrial, communications and signal-processing solutions that demand a balance of performance and reliability.

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